Toshiba Expands Line-up of Industrial Grade e∙MMC™ Ver. 5.1 Compliant Embedded NAND Flash Memory Products

-- Operating temperature range enhanced to +105°C --

TOKYO — (BUSINESS WIRE) — December 20, 2016Toshiba Corporation’s (TOKYO:6502) Storage & Electronic Devices Solutions Company today announced the launch of JEDEC e∙MMC™ Version 5.1[1] compliant embedded NAND flash memory products with an enhanced operational temperature range of -40°C to +105°C. The new products integrate NAND chips fabricated with 15nm process technology and are designed for industrial applications, including PLC[2], CoMs[3] and factory automation equipment, and can also be used in a wide range of consumer applications. The line-up offers densities of 8GB, 16GB, 32GB and 64GB. Sample shipments start from today, with mass production scheduled for March 2017.

This Smart News Release features multimedia. View the full release here: http://www.businesswire.com/news/home/20161220005384/en/

Toshiba: Industrial grade e-MMC embedded NAND flash memory product with an enhanced operational temp ...

Toshiba: Industrial grade e-MMC embedded NAND flash memory product with an enhanced operational temperature range of -40 degrees Celsius to +105 degrees Celsius (Photo: Business Wire)

The new products integrate NAND chips with a controller to manage basic control functions for NAND applications in a single package. As a complement to Toshiba’s current industrial product group of e∙MMC, which have an operating temperature range of -40 to +85°C, the new e∙MMC product family support applications that require e∙MMC storage solutions to operate at higher temperatures, up to +105°C. This enhanced range offers users more freedom of choice in developing memory solutions for industrial applications in high temperature environments.

In the consumer and industrial market, demand for e∙MMC with high temperature support continues to grow, for applications requiring higher performance and higher power consumption. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products and will continue to take leadership in the market.

 

New Product Line-up

Part Number   Capacity   Temperature Range   Package
THGBMHG6C1LBAU6 8GB -40℃~+105℃ 11.5x13x0.8mm
THGBMHG7C2LBAU7 16GB -40℃~+105℃ 11.5x13x1.0mm
THGBMHG8C4LBAU7 32GB -40℃~+105℃ 11.5x13x1.0mm
THGBMHG9C8LBAU8   64GB   -40℃~+105℃   11.5x13x1.2mm
 

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