IPC’s PCB Technology Trends Report Details How PCB Manufacturers Meet Current and Future Technology Demands

This report covers five main focus areas: higher density, design concerns/signal integrity, change in processing/manufacturing techniques, technical business challenges, and compliance/environmental issues.

Data from report indicate:

  • HDI (high density interconnect) usage/fabrication has increased from 37.5% to just over 49% in five years. In addition, the median has shifted from 35% present day to 50% in five years. This indicates more of the respondents predict even greater usage/specification of HDI boards in five years.
  • In terms of PCB design limitations, heat dissipation is a major concern based on the respondents’ answers. The majority of the respondents (71%) indicated thermal vias are the primary method to manage heat dissipation.
  • Respondents indicated that there will be continued use of a variety of solderable finishes. The consensus that there is no universal finish (one that meets everyone’s needs) is prevalent.
  • Respondents face a wide variety of business challenges:  achieving better yields, moving up the technology curve, workforce training and finding competent personnel are key levers needed to drive business.
  • Respondents overwhelmingly are losing sleep over workforce development, lack of staff’s basic engineering skills, supply chain lead times and product overregulation.

PCB Technology Trends 2023 is available to IPC members for $595 and $995 for nonmembers. For more information or to purchase the report, visit IPC’s  Online Store.

Featured Video
Editorial
Jobs
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Upcoming Events
FABTECH Orlando 2024 at Orange County Convention Center Orlando FL - Oct 15 - 17, 2024
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise