UMC Completes Environmental Production Declaration for Its Integrated Circuit Wafers
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UMC Completes Environmental Production Declaration for Its Integrated Circuit Wafers

HSINCHU, Taiwan, Oct. 19 /PRNewswire-Asia-FirstCall/ -- UMC (NYSE: UMC) (TSE: 2303), a leading global semiconductor foundry, today announced that it has completed the EPD (Environmental Production Declaration) verification for integrated circuit wafers produced at its facilities. UMC conducted EPD on its 200mm wafers at the company's Fab 8A following international standards ISO 14040, 14044,14025 and IC PCR, with the results receiving third party verification by Det Norske Veritas (DNV). DNV is an accredited verifier that is recognized by EPD(R) system Sweden.

Mr. Muh Liang Liao, vice president from UMC, said, "UMC has always valued environmentally sustainable growth as an important part of our business. As such, we provide Total Green Solutions to help customers produce high quality, environmentally friendly products. UMC's completion of EPD underscores our commitment to social responsibility by following a rigid international verification system that tracks and monitors various aspects during IC wafer manufacturing that may impact the environment. Furthermore, it provides customers with comprehensive environmental information to help them document the green supply chain of their product manufacturing."

UMC will build upon this achievement to help enhance the entire supply chain by aggressively implementing green supply chain programs and helping customers to produce green products that have lower impact on the environment.

About UMC

UMC (NYSE: UMC) (TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the strength of the company's leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 12,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com

    Editorial Contacts:

     In the USA:
     UMC-USA
     Charlene Loveless
     Tel: +408-523-7850

     In Taiwan:
     UMC
     Richard Yu
     Tel:   +886-2-2700-6999 ext. 6951
     Email: richard_yu@umc.com

SOURCE United Microelectronics Corporation

Web site: http://www.umc.com/