AMD Thermal and stress simulations saved time in the development of a new Advanced Micro Devices (AMD) microprocessor by validating thermal design of the chip and special test equipment prior to prototyping. The company used FloTHERM software to model the performance of the semiconductor and test equipment in realistic cooling environments. They also predicted the temperature of the various elements within the package as well as the temperatures and thermal stresses that are applied to test equipment.
You are reviewing the
Download.
Your machine is locate at 3.144.235.141.
