WILSONVILLE, Ore. — (BUSINESS WIRE) — November 21, 2011 — Continuing in its tradition of promoting and recognizing printed circuit board (PCB) design excellence, Mentor Graphics Corporation (NASDAQ: MENT) today announced winners of its 23rd annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and computer aided design (CAD) designers who use innovative methods and design tools to address today’s complex PCB systems’ design challenges and produce industry-leading products.
"Mentor Graphics’ Technology Leadership Awards showcases the best electronics design teams in the industry,” said Pete Waddell, president of UP Media and publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine. “The complexity of the designs and the commitment of the teams who worked on the designs, is a testament to the talents and innovative abilities of engineers and designers involved. They certainly earned the respect of those of us who are fortunate to be involved with the program.”
Industry experts judged entries from around the world in five categories representing a wide variety of industries. The PCB industry expert judges included Happy Holden, retired and former CTO, Foxconn Advanced Technology; Gary Ferrari, technical support director, FTG Circuits; Pete Waddell, president of UP Media, publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine; Andy Kowalewski, senior interconnect designer, AdvantagePCB; and Rick Hartley, senior principal engineer, Avionics Division of L-3 Communications.
2011 Technology Leadership Award Winners
Category: Best Overall Design
Company: Wipro Technologies, India
Design team: Rakesh Raju Nadimetla, Radesh Gupta
Using: Board Station® RE, XtremePCB™, HyperLynx® SI/PI
Category: Computers, Blade & Servers, Memory Systems
1st place: GE Intelligent Platforms, UK
Design team: Mike Tapp, Rob Savage, Bryan Ledger, Stuart Connolly
Using: Expedition® PCB, HyperLynx SI/PI
2nd place: PFU, Japan
Design team: Junichi Nakagawa, Yuusuke Amakata, Seiji Yoshinaga, Yasuhide Chigawa
Using: Expedition PCB, CES, XtremePCB, HyperLynx SI/PI
Category: Consumer Electronics & Handhelds
1st place: LG Electronics, South Korea
Design team: Junhyeok Lee, Inmu Kim, Kun Joo
Using: Expedition Enterprise
2nd place: Avolites, UK
Designer: Alwyn Fernandes
Using: PADS®
Category: Industrial Control, Instrumentation, Security & Medical
1st place: Verigy, Germany
Designer: Oliver Knitterscheidt
Using: Board Station, HyperLynx PI
2nd place: Agilent, China
Designer: Bo Yao
Using: Expedition PCB
Category: Military & Aerospace
1st place: GE Intelligent Platforms, UK
Design team: Jim Rose, Michael Brewin, David Hart
Using: Expedition PCB, HyperLynx SI/PI
2nd place: SELEX Galileo S.p.A., Italy
Design team: Maurizio Pagani, Matteo Seminari, Aldo Boschiroli, Gregorio Vitale
Using: Expedition Enterprise, HyperLynx
Category: Telecom, Network Controllers, Line Cards
1st place: Alcatel-Lucent, USA
Design team: Mei Wong, Carboy Zhang Li Bo, Mark Darby, Aydin Cokoyoglu
Using: Board Station RE
2nd place: F5 Networks, USA
Design team: Debra Bandimere, Jarom Daines, Eric Daines, Jerry Canterbury
Using: CES, Expedition PCB
Category: Transportation & Automotive
1st place: Johnson Controls, USA
Design team: Scott Smith, Siddesh Vishwanath, Krzysztof Russa
Using: Expedition PCB, CES
2nd place: Huizhou Desay, China
Designer: Tan Baichuan
Using: Expedition PCB
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