North American Semiconductor Equipment Industry Posts January 2013 Book-to-Bill Ratio of 1.14

SAN JOSE, Calif. — February 21, 2013 — North America-based manufacturers of semiconductor equipment posted $1.09 billion in orders worldwide in January 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the January Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.14 means that $114 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in January 2013 was $1.09 billion. The bookings figure is 17.2 percent higher than the final December 2012 level of $927.4 million, and is 8.5 percent lower than the January 2012 order level of $1.19 billion.

The three-month average of worldwide billings in January 2013 was $952.1 million. The billings figure is 5.4 percent lower than the final December 2012 level of $1.01 billion, and is 23.2 percent less than the January 2012 billings level of $1.24 billion.

“In January 2013, the three-month average for bookings improved again for new semiconductor manufacturing equipment orders placed by worldwide customers to North American manufacturers, while billings declined slightly,” said Denny McGuirk, president and CEO of SEMI.  “The ratio is above parity for the first time since May 2012, although both orders and billings currently remain tempered by the economy and relatively conservative spending plans at the start of the year.” 

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill

August 2012

1,331.5

1,092.9

0.82

September 2012

1,164.4

912.8

0.78

October 2012

985.5

742.8

0.75

November 2012

910.1

718.6

0.79

December 2012 (final)

1,006.1

927.4

0.92

January 2013 (prelim)

952.1

1,086.7

1.14

Source: SEMI, February 2013


The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the  Equipment Market Data Subscription (EMDS).

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 2,000 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit  www.semi.org.

Association Contacts

Dan Tracy/SEMI
Phone: 1.408.943.7987
Email:  Email Contact

Deborah Geiger/SEMI
Phone: 1.408.943.7988
Email:  Email Contact

Notes:

Next SEMI Book-to-Bill:  March 21,  2013 at 3:00pm Pacific Daylight Time (PDT)  

For information on SEAJ Book-to-Bill Report, visit  www.seaj.or.jp 

Featured Video
Editorial
Jobs
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Upcoming Events
Formnext 2024 - Additive Manufacturing (AM) and industrial 3D Printing at Messe Frankfurt, Messeparkhaus Rebstock, 60327 Frankfurt am Main Frankfurt Germany - Nov 19 - 22, 2024
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise