eSilicon to Present on Advanced Technologies for Packaging and Physical IP at DAC 2013

SUNNYVALE, CA -- (Marketwired) -- May 29, 2013 --


What:
eSilicon will present on emerging packaging technologies as well as advanced physical IP -- including the challenges of FinFET and FD-SOI technologies that will take us to 14nm.

Where:
Design Automation Conference (DAC 2013)
Austin, Texas

When:
June 2-5, 2013

Who:

Advanced Technologies Driving Selective Memory Customization
ChipEstimate.com Booth #2446
eSilicon's Patrick Soheili, VP and GM, IP Solutions Group, and Lisa Minwell, senior director, IP Solutions Marketing, will present.

  • Monday, June 3, 11:30 AM
  • Tuesday, June 4, 2:00 PM
  • Wednesday, June 5, 1:30 PM

What's beyond 28nm? Advanced IP for Advanced Chip Solutions
GLOBALFOUNDRIES Open Theater Booth #1314
eSilicon's Patrick Soheili, VP and GM, IP Solutions Group, will present.

  • Tuesday, June 4, 3:45 PM

Concurrent Design Delivers Innovative Package for Fast Time-to-Market Solution
GLOBALFOUNDRIES Open Theater Booth #1314
eSilicon's Gino Skulick, VP and GM, SDMS Solutions, will present an integrated approach to a very low cost, low power, small form factor device produced for the mobile market.

  • Monday, June 3, 2:45 PM
  • Wednesday, June 5, 11:05 AM

Targeted IP Solutions for Mobile, Compute, Connect and Store
GLOBALFOUNDRIES Private Theater Booth #1314
eSilicon's Lisa Minwell, senior director, IP Solutions Marketing, will present.

  • Wednesday, June 5, 2:00 PM

About eSilicon
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.

eSilicon -- Enabling Your Silicon Success™

eSilicon and eSilicon Access are registered trademarks, and the eSilicon logo and Enabling Your Silicon Success are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine

Contacts:
Sally Slemons
eSilicon Corporation
408-616-4695

Email Contact 

Susan Cain
Cain Communications
408-393-4794

Email Contact 


Featured Video
Editorial
Jobs
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Upcoming Events
FABTECH Orlando 2024 at Orange County Convention Center Orlando FL - Oct 15 - 17, 2024
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise