With more than 3 billion HDMI-enabled devices shipped to date, second screen viewing is experiencing record growth as consumers increasingly connect mobile devices to their main TV. Existing solutions impede the consumer viewing experience with inconsistent, unreliable video streaming, mediocre HD picture quality and a lack of portability.
"The way we experience TV is changing rapidly," commented Daniel Kim, Technology Analyst at Paradigm Capital. "Content providers have begun offering real-time, interactive social media experiences simultaneously on the TV and mobile device. The second screen experience needs to be delivered seamlessly at a cost that's accessible to the mainstream and Spectra7's approach addresses these requirements in a straightforward manner."
The CC7000 is the industry's first chip capable of delivering Deep Color and 60 frames per second video for true, real-time 1080p HD or 4K Ultra HD TV anytime, anyplace at an optimal viewing distance. The CC7000's patented chip technology leverages Spectra7's high-speed, active signal processing without requiring any external power source while running at up to 18 Gbps. The chip is designed to enable ultra-thin, extended connectivity amongst existing HDMI 1.4b and next generation HDMI 2.0 devices. Housed in an ultra-small, low profile 5x5mm QFN package, the CC7000 enables new levels of portability and ease of use demanded by the expanding universe of mobile device users.
"As the latest in a series of game-changing chips from Spectra7, the CC7000 is at the leading edge of high speed signal processing," said Tony Stelliga, CEO of Spectra7. "We are excited by the incredible customer demand for this disruptive technology that revolutionizes how consumers will watch, stream and store media content."
The CC7000 is available now under Spectra7's Partner Program.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high performance analog semiconductor company delivering unprecedented speed, resolution and signal fidelity to consumer and wireless infrastructure products. Spectra7's new system-level components address throughput bottlenecks and satisfy the exponential demand for more bandwidth and lower costs in mobile and internet infrastructure equipment, including handsets, tablets, base stations and microwave backhaul systems. Spectra7 is headquartered in Markham, Ontario with development centers in Silicon Valley, Irvine, California and Cork, Ireland. For more information, please visit www.spectra7.com.
Certain information in this news release may constitute forward-looking information. This information is based on current expectations that are subject to significant risks and uncertainties that are difficult to predict. Actual results might differ materially from results suggested in any forward-looking statements. Spectra7 assumes no obligation to update the forward-looking statements, or to update the reasons why actual results could differ from those reflected in the forward looking-statements unless and until required by securities laws applicable to Spectra7. Additional information identifying risks and uncertainties is contained in Spectra7's filings with the Canadian securities regulators available at www.sedar.com.
Neither the TSX-V nor its Regulation Services Provider (as that term is defined in the policies of the TSX-V) accepts responsibility for the adequacy or accuracy of this release.
Contacts: Spectra7 Microsystems Inc. Robert Munro Communications (905) 480-9109 ext. 269 pr@spectra7.com www.spectra7.com
