MIPI® Alliance Introduces Enhanced UniProSM and M-PHY® Specifications

Specifications are Core Technologies for JEDEC® Universal Flash Storage, PCI-SIG® Mobile PCIe and USB SuperSpeed Inter-chip

TORONTO — (BUSINESS WIRE) — October 8, 2013The MIPI® Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announces the availability of new versions of its UniProSM and M-PHY® specifications. These specs address power efficient, high-speed serial links in a battery-powered environment. End markets benefitting from the specifications include handheld devices, digital cameras, video cameras, intelligent watches, tablets and smart phones.

The UniPro specification, in combination with the M-PHY specification, is used by JEDEC for the newly introduced Universal Flash Storage (UFS) v2.0 Standard. The M-PHY spec is also utilized by PCI-SIG for the Mobile PCIe (M-PCIe™) standard, and by USB-IF for the USB 3.0 SuperSpeed Inter-Chip (SSIC) standard.

“MIPI Alliance continues to be on the forefront of pushing mobile and mobile-influenced devices to higher performance while maintaining our commitment to keep cost and power as low as possible,” said Joel Huloux, Board Chairman of MIPI Alliance. “For device manufacturers using UFS, M-PCIe, SSIC or creating battery powered handheld products such as high-end cameras that consume high-speed flash memory, or require fast communication channels between two processors on the same PCB, the MIPI UniPro and M-PHY specifications offer unique features that allow them to provide added value to consumers.”

The UniPro v1.6 specification adds enhanced features to provide significant power savings, and increase system performance by doubling the link speed to 6Gbps per lane. Additionally, it reduces and simplifies the hardware overhead to allow for simpler integration and more cost-effective designs.

The M-PHY 3.0 specification doubles the current bandwidth while retaining the same distance reach as its predecessor. It also maintains the MIPI Alliance mobile priorities of low power, minimal protocol impact (modularity), and fast transitions between power states.

By using the combination of UniPro and M-PHY, device manufacturers will be able to greatly increase data rates, save power and have better EMI compliance and less radiation, allowing them to focus on adding new and indispensable features to mobile handheld devices. When used in conjunction with MIPI Alliance’s Camera Serial Interface (CSI), or other partner alliance specifications, this translates to faster booting times, extremely fast PC to handheld file transfers, fast firmware Flash upgrades, high camera resolutions and frame rates, and virtually zero shutter lag.

For more information about these specifications, or the MIPI Alliance, please contact  Mike Krell – director, marketing and membership.

About MIPI

MIPI® Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. Founded in 2003, the organization has more than 250 member companies worldwide, more than a dozen active working groups, and has delivered more than 45 specifications within the mobile ecosystem in the last decade. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, please visit  www.mipi.org.

MIPI®, M-PHY®, and UniProSM are trademarks, servicemarks, registered trademarks, and/or registered servicemarks owned by MIPI Alliance. All other trademarks, servicemarks, registered trademarks, and registered servicemarks are the property of their respective owners.



Contact:

Sunwest Communications
Stacey Gaswirth, 214-373-1601
sgaswirth@sunwestpr.com
or
Katie Olivier, 214-373-1601
kolivier@sunwestpr.com

Featured Video
Editorial
Jobs
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Engineer 2 for Lam Research at Fremont, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Engineer 3 for Lam Research at Fremont, California
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise