Research and Markets ( http://www.researchandmarkets.com/research/sl83ms/stmicroelectronics) has announced the addition of the "STMicroelectronics LSM303D 6-axis electronic compass - Reverse Costing Analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

System Plus Consulting is proud to publish the reverse costing report of the new 6-Axis electronic compass supplied by STMicroelectronics.

The LSM303D is a system-in-package featuring a 3-axis magnetometer and a 3-axis accelerometer. With a 3x3x1mm package size, it belongs to the smallest eCompasses for consumer applications.

The 3-Axis accelerometer uses the TSV process of ST in order to remove the area reserved for I/O pads. The magnetometer dies use the latest process of Honeywell.

The LSM330D is targeted for consumer applications: Tilt compensated compass, Map rotation, Position detection It provides accurate output across full-scale ranges up to ±16g (linear acceleration) and ±12 Gauss (magnetic field).

This report provides complete tear-down of the 6-Axis electronic compass with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Key Topics Covered:

Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

Company Profiles

Physical Analysis
- Package X-Ray
- Package Opening
- Package Cross-Section
- ASIC Dimensions
- ASIC Delayering
- ASIC Cross-Section
- MEMS Accelerometer Dimensions
- MEMS Accelerometer Cap Opening
- MEMS Accelerometer Sensing Area
- MEMS Accelerometer Cross-section
- X/Y-Axis Magnetometer Dimensions
- X/Y-Axis Magnetometer Delayering
- X/Y-Axis Magnetometer Cross-section
- Z-Axis Magnetometer Dimensions
- Z-Axis Magnetometer Delayering
- Z-Axis Magnetometer Cross-section

Manufacturing Process Flow
- Front-End Manufacturing Process Flows
- Description of the Wafers Fabrication Units
- Back-End Packaging Process Flow
- Back-End Packaging Assembly Unit

Cost Analysis
- Yields Hypotheses
- ASIC Wafer Cost
- ASIC Die Cost
- MEMS Accelerometer Wafer Cost
- MEMS Accelerometer Die Cost
- X/Y-Axis Magnetometer Wafer Cost
- X/Y-Axis Magnetometer Die Cost
- Z-Axis Magnetometer Wafer Cost
- Z-Axis Magnetometer Die Cost
- Back-End: Packaging Cost
- Back-End: Final test & Calibration Cost
- LSM303D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis
- Manufacturer Financial Ratios
- LSM303D Estimated Selling Price

For more information visit  http://www.researchandmarkets.com/research/sl83ms/stmicroelectronics

Research and Markets
Laura Wood, Senior Manager
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SOURCE Research and Markets