The awards were based on surveys completed by conference attendees.
"Our customers appreciate and benefit from the work Cadence is doing to bring 16nm FinFET design to market," said Suk Lee, TSMC senior director of Design Infrastructure Marketing. "These technical papers move the ball forward by helping leading innovators embrace the most advanced manufacturing processes available."
The papers can be viewed and downloaded from TSMC Online™.
Cadence previously announced that the company received three TSMC Partner of the Year awards at the OIP conference for work with TSMC on analog/mixed signal IP, 16nm FinFET design infrastructure, and 3D-IC design solutions.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
© 2013 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.
Add to Digg Bookmark with del.icio.us Add to Newsvine
For more information, please contact: Cadence Newsroom 408-944-7039 newsroom@cadence.com
