Reduces mounting area by 90%

TOKYO — (BUSINESS WIRE) — March 26, 2014 — Toshiba Corporation (TOKYO:6502) today announced the launch of ultra-small chip scale package white LEDs for lighting applications that can reduce the mounting area by 90% compared to conventional 3.0 x 1.4 mm package products. ^[1] The new “TL1WK series” will start sample shipment from April.

Toshiba: Ultra-Small Chip Scale Package White LEDs for Lighting Applications (Photo: Business Wire)

The new products utilize gallium nitride-on-silicon (GaN-on-Si) process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are the industry’s smallest in sub-watt class (1/4-1/2W) white LEDs^[2], with a package size of just 0.65 x 0.65mm, but they achieve a luminous efficacy of 130lm/W^[3] and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.

The new white LEDs will be showcased at “Light+Building”, a trade fair for lighting and architecture in Frankfurt, Germany from March 30 to April 4.

Applications

Light sources for general lighting, including straight tube lights, light bulbs and ceiling lights