Deadline to Submit Your Abstract Extended!
Submit by Friday, July 18th
The DesignCon 2015
Call for Technical Papers, Panels and Tutorials is drawing to a close! With the 4th of July festivities last week, we decided to give you an extra week to get caught up. DesignCon gives the chip, board & systems design engineering community the unique opportunity to gather for four days and learn the latest design techniques, methodologies and tools around SI & PI, high-speed serial design, PCB design tools, test & measurement and more.
Individuals presenting papers at DesignCon join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews. Submit your abstract for the chance to share your expertise in the areas of signal and power integrity, test & measurement and verification.
Deadline to submit is Friday, July 18, 2014.
The 2015 Topic Categories
The 2015 technical program will consist of
14 tracks:
- Optimize Chip-Level Designs for Signal and Power Integrity
- Overcome Analog and Mixed-Signal Modeling and Simulation Challenges
- Wireless and Photonic Integration
- System Co-Design: Chip/Package/Board: Modeling and Simulation
- Characterize PCB Materials and Processing Characterization
- Apply PCB Design Tools
- Design Parallel and Memory Interfaces
- Optimize High-Speed Serial Design
- Detect and Mitigate Jitter, Crosstalk, and Noise
- Leverage High-Speed Signal Processing for Equalization and Coding
- Ensure Power Integrity in Power Distribution Networks
- Achieve Electromagnetic Compatibility and Mitigate Interference
- Apply Test and Measurement Methodology
- Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques
Who Should Submit?
Past DesignCon speakers include: Analog Engineers, Application Engineers, CTOs, Design Engineers, Directors of Engineering, Editors, EMC Engineers, Engineering Managers, Fellows, Hardware Engineers, Members of Technical Staff, Principal Engineers, Product Engineers, Professors, R&D Engineers, Signal Integrity Engineers, Systems Engineers, Technical Directors, VPs of Engineering and more.
How to Submit
Final papers will be due November 10, 2014. We look forward to receiving your submissions, and good luck!
Regards,
Katie Stern
Event Director
DesignCon 2015
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