Research and Markets ( http://www.researchandmarkets.com/research/drnqw4/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21100 - 6-Axis MEMS IMU Reverse Costing Analysis" report to their offering.

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With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.

The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.

Assembled in a LGA 3.0×3.0×0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.

The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.

Key Topics Covered:

1. Glossary

2. Overview/Introduction , Maxim Company Profile

3. Physical Analysis

Package

• Package Views & Dimensions
• Package Opening
• Wire Bonding Process
• Package Cross-Section

ASIC Die 

• View, Dimensions & Marking
• Delayering
• Main Blocks Identification
• Cross-Section
• Process Characteristics

MEMS Die 

• View, Dimensions & Marking
• Bond Pad Opening
• Cap Removed & Cap Details
• Sensing Area Details
• Cross-Section (Sensor, Cap & Sealing)
• Process Characteristics

Consumer 6-Axis IMU Comparison

4. Manufacturing Process Flow

• Global Overview
• ASIC Front-End Process
• ASIC Wafer Fabrication Unit
• MEMS Process Flow
• MEMS Wafer Fabrication Unit
• Packaging Process Flow & Assembly Unit

5. Cost Analysis

• Main steps of economic analysis
• Yields Hypotheses
• ASIC Front-End Cost
• ASIC Back-End 0 : Probe Test & Dicing
• ASIC Wafer & Die Cost
• MEMS Front-End Cost
• MEMS Back-End 0 : Probe Test & Dicing
• MEMS Front-End Cost per process steps
• MEMS Wafer & Die Cost
• Back-End : Packaging Cost
• Back-End : Packaging Cost per Process Steps
• Back-End : Final Test Cost
• MAX21100 Component Cost
• Consumer 6-Axis IMU Cost Comparison

6. Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/drnqw4/maxim_integrated

Media Contact: Laura Wood, +353-1-481-1716, Email Contact

SOURCE Research and Markets