Toshiba to Showcase World's First PCI Express Single Package SSD at CES

TOKYO — (BUSINESS WIRE) — January 6, 2015Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company announced it will showcase a reference display of the world’s first[1] PCI Express (PCIe) single package SSD, integrating up to 256 GB in a single BGA package, at the 2015 International Consumer Electronics Show (CES), to be held from January 6 to January 9 in Las Vegas, U.S.A.

Toshiba: World's First PCI Express Single Package SSD (Photo: Business Wire)

Toshiba: World's First PCI Express Single Package SSD (Photo: Business Wire)

The “BG Series” SSDs on reference display will be products under development. Utilizing Toshiba’s cutting-edge packaging technology applied in products like e・MMCTM, it is the world’s first PCI Express single package SSD, available in capacities up to 256 GB in a 16 mm x 20 mm x 1.65 mm BGA package. Also to be showcased will be a reference display of the world’s smallest[2] removable module type SSD, which integrates the BGA single package SSD on a single-sided form factor.

The new SSDs incorporate PCI Express, a high speed serial I/O interface for PCs, as physical interface and NVM Express optimized for SSDs as command interface.

The single package type SSDs of the new series weigh below 1 g, reducing weight by approximately 98%[3], compared to 2.5-inch types widely used in PCs. It also reduces storage space by more than 95%[4]. It can contribute to light-weight mobile PCs and also to longer battery life by increasing available space for battery packs.

Outline of the Reference Display

BG Series

Form Factor   Single Package type
Capacity 128 GB   256 GB
Size   W 16 mm 16 mm
D 20 mm 20 mm
  H 1.40 mm   1.65 mm
Interface Standard Physical PCI Express Base Specification Revision 3.0
  Command   NVM Express revision 1.1
 

1 | 2  Next Page »
Featured Video
Editorial
Jobs
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Engineer 3 for Lam Research at Fremont, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Equipment Engineer, Raxium for Google at Fremont, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise