Efficient heat dissipation realizes high-current operations in compact packages
TOKYO — (BUSINESS WIRE) — February 27, 2015 — Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced the launch of a new surface–mount package series in its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation. The shipment of the 4 new products in the “DSOP Advance package” series starts from today.
Toshiba: Low-Voltage MOSFETs with Dual-sided Cooling "DSOP Advance" Packages (Photo: Business Wire)
The new devices have a heat sink on both sides of the package to improve heat dissipation, making it possible to realize high-current operations in compact packages.
The new MOSFETs share the same 5mm x 6mm footprint as Toshiba’s current SOP Advance package, facilitating replacement without any need to modify existing PCB layouts.
Applications:
Switching power supplies
for servers and mobile devices, etc.
|
Line-up: |
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| Part No. |
VDSS
(V) |
VGSS
|
RDS(ON) (mΩ) |
Ciss
|
Crss
|
Coss
|
rg
(Typ.) (Ω) |
Qg (10V)
(Typ.) (nC) |
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|
VGS = 10V |
VGS = 4.5V |
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| Typ. | MAX | Typ. | MAX | |||||||||||||||||||
| TPWR8503NL | 30 | ±20 | 0.72 | 0.85 | 1.0 | 1.3 | 5300 | 130 | 2700 | 1.2 | 74 | |||||||||||
| TPWR8004PL | 40 | ±20 | 0.65 | 0.8 | 0.95 | 1.35 | 7370 | 58 | 1930 | 0.6 | 103 | |||||||||||
| TPW4R008NH | 80 | ±20 | 3.3 | 4.0 | - | - | 4100 | 32 | 890 | 1.2 | 59 | |||||||||||
| TPW4R50ANH | 100 | ±20 | 3.7 | 4.5 | - | - | 4000 | 31 | 700 | 1.0 | 58 | |||||||||||
