SFP+ Connector and Cable Assembly Also Improve Signal Routing, Minimize EMI

HARRISBURG, Pa. – March 10, 2015 – TE Connectivity (TE), a world leader in connectivity, today announced its new micro SFP+ connector and cable assembly, which slashes space requirements on faceplates and printed circuit boards (PCBs) in telecommunications, data communications, networking and medical diagnostic equipment. The new micro SFP+ connector and cable assembly are up to 50 percent smaller in width and length than current SFP+ interconnects, enabling denser equipment designs than have ever before been possible.

The new micro SFP+ connector and cable assembly supports up to 10 Gb/s data transmission and 10 Gigabit Ethernet, Gigabit Ethernet, Fibre Channel, InfiniBand, and Fibre Channel over Ethernet (FCoE) protocols. The new product delivers several key benefits to customers:

• Increases faceplate density / saves PCB space: Micro SFP+ needs as little as 15mm board space. One micro SFP+ frees up 19 percent more faceplate space than one SFP+ connector.

• Improves signal integrity: The cable assembly and connector were designed with a staggered contact configuration that improves signal routing. Additionally, the bottom and top contacts have been further optimized for speed.

• Reduces electromagnetic interference (EMI): EMI is minimized through a diecast housing, cable shield crimped at 360 degrees, and an extended EMI shield over the cable’s plug.

• Optimizes manufacturing processes: For manufacturing automation, the board interconnect combines the connector and cage into one finished product for automated board placement. High temperature pin-in-paste soldering can be achieved as the product withstands up to 265 degrees Celsius.

“Our new micro SFP+ connector and cable assembly is ideal for communications equipment designs where space is at a premium,” said Roel van Lokven, product manager for cable and cable assemblies in TE Data Communications. “This is the latest in a series of TE connector innovations that uniquely enables denser designs, higher performance and more cost-effective manufacturing.”