TOKYO — (BUSINESS WIRE) — April 27, 2015 — Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced the launch of a photocoupler that combine 15Mbps high-speed communication with low power consumption. The new product, “TLP2761”, which also guarantees a creepage and clearance distance of 8mm, starts shipments from today.

Toshiba: Low Power Consumption 15Mbps High-speed Photocoupler with Creepage and Clearance Distance of 8mm "TLP2761" (Photo: Business Wire)

The new photocoupler has a low height of 2.3mm (max), an approximately 45% reduction from conventional SDIP package products, and contribute to the development of thinner and smaller sets. Despite the low height, the new product guarantees a creepage and clearance distance of 8mm (min), and isolation voltage of 5000Vrms (min), making it suitable for applications requiring higher isolation specs.

“TLP2761” incorporate Toshiba's original high output infrared LEDs in the input side and reduces the threshold input current by approximately 54% compared with Toshiba conventional products^[1]. In the output side, it contains a photo detector IC die fabricated with a Bi-CMOS process, and reduces the supply current by approximately 66% compared with conventional products^[1]. Furthermore, it can contribute to lowering the operation voltage of sets with guaranteed supply voltage of 2.7V to 5.5V, at temperatures up to 125 degrees Celsius, the industry’s highest class^[2] of operation.

Key Specifications of the New Product:

• 2.3mm height SO6L package
• Creepage/Clearance distance: 8mm(min.)
• Low threshold input current: 1.6 mA (max), 6mW(typ.)
• Low supply current: 1.0 mA(max), 2.1mW(typ.)
• Supply voltage: 2.7~5.5 V
• Operation temperature: 125 degrees Celsius (max)

Applications:

• Inverters
• Servo amp
• Photovoltaic inverter
• FA network
• I/O interface