Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices

-Supports communications by low-profile Bluetooth Smart applications in a very thin chip-scale package-

TOKYO — (BUSINESS WIRE) — February 23, 2016Toshiba Corporation's (TOKYO:6502) Semiconductor & Storage Products Company today announced the launch of “TC3567WBG-006”, a new line-up of Bluetooth® Low Energy[1] (LE) communication ICs that support Bluetooth Core Version 4.1 for use with Scatternet[2] devices. Sample shipments start today.

This Smart News Release features multimedia. View the full release here: http://www.businesswire.com/news/home/20160223005900/en/

Toshiba: "TC3567WBG-006", a compact Bluetooth(R) Low Energy Communication IC for Scatternet Devices  ...

Toshiba: "TC3567WBG-006", a compact Bluetooth(R) Low Energy Communication IC for Scatternet Devices (Photo: Business Wire)

Based on Toshiba’s already released “TC35667FTG/FSG-005” for Bluetooth Smart devices, the new IC is configured with new ROM software for Scatternet and multipoint connection, in a very thin chip-scale package, only 2.88mm x 3.04mm x 0.3mm. It will bring Bluetooth Low Energy communication networks to low-profile applications, such as contactless cards, tags and tickets.

The Scatternet standard defines two functions in the Bluetooth Core specification, for Version 4.0 and higher. Compliant devices have to support either multiple or simultaneous connections with Master and Slave devices or multiple connections between two or more Master devices at the same time. Toshiba’s new IC supports both functions with Bluetooth Low Energy, making it easy to create a network with very small devices.

Samples of packaged chips for Scatternet, “TC35667FTG-006/FSG-006”, and of “TC35670FTG-006”, which supports both Bluetooth and NFC tag functionality, also start to ship today.

Toshiba will contribute to the realization and promotion of Scatternet-based communication networks with low-profile applications, and support devices that optimize communication functions required for Internet of Things (IoT) applications, such as auto-monitoring systems and multifunctional applications.

Key Features of the New Product

  • Low power consumption:
    • Less than 5.9mA at peak current consumption of Bluetooth communication (@3.3V, -4dBm transmitter output power or receiver operation)
    • 50nA typical current consumption in deep sleep (@3.3V)
  • Receiver sensitivity: -92.5dBm
  • Supports Bluetooth Low Energy central and peripheral devices
  • Supports servers and client functions defined by GATT (Generic Attribute Profile)

Applications
Bluetooth Smart devices, including connected home products, wearable devices, healthcare devices, smartphone accessories, remote controllers, toys and IoT devices.

 

Main Specifications

Part Number   TC35667WBG-006
Operating Voltage Range 1.8V to 3.6V

Current Consumption

Lower than 5.9mA (@3.3V, Bluetooth LE operation, -4dBm transmitter operation or receive operation)
Current Consumption, Deep Sleep 50nA typical (@3.3V)
Operating Temperature -40°C to 85 °C
Package   WCSP41, 2.88mm x 3.04mm x 0.3mm, 0.4mm pitch
Bluetooth Part
Bluetooth Version Version 4.1

Central and peripheral function

Scatternet function, multipoint connection

Transmitter Output Power 0dBm to -20dBm (4dB steps)
Receiver Sensitivity -92.5dBm
Profiles GATT (Generic Attribute Profile), including server and client functions
Interfaces UART, I 2 C, SPI, GPIO
Other Features   DC-DC Converter

Low drop regulator

General purpose ADC

User program function

Wake up signal for host device

PWM function

 

1 | 2  Next Page »
Featured Video
Editorial
Jobs
Mechanical Engineer 3 for Lam Research at Fremont, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise