This innovative method has already been implemented at customer site with outstanding results

Camtek Ltd. (NASDAQ: CAMT; TASE: CAMT), today announced the launch of an innovative inspection method for Fan-Out Wafer Level Packaging (FOWLP). This new inspection method compares the image acquisition of the dies on the reconstructed wafer with the computer-aided design (CAD) data used in fabricating the wafer.

Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, "Camtek has more than 25 years of experience working with CAD data in our Automated Optical Inspection (AOI) systems for the PCB industry. The development of this new method for the inspection of Fan-Out applications is based on this experience and accumulated know-how."

Continued Mr. Langer: "Industry experts expect Fan-out wafer level packaging technology to grow in excess of 30% annually over the coming years. The Fan-out packaging process imposes many inspection challenges, especially due to alignment issues. We believe that using the CAD as a reference for detecting the reconstructed wafers will make our Eagle product the tool of choice for Fan-out applications."

ABOUT CAMTEK LTD. 

Camtek Ltd. provides automated and technologically advanced solutions dedicated to enhancing production processes, increasing products yield and reliability, enabling and supporting customer's latest technologies in the Semiconductors, Printed Circuit Boards (PCB) and IC Substrates industries.

Camtek addresses the specific needs of these interconnected industries with dedicated solutions based on a wide and advanced platform of technologies including intelligent imaging, image processing and functional 3D inkjet printing.

This press release is available at http://www.camtek.com

This press release may contain projections or other forward-looking statements regarding future events or the future performance of the Company. These statements are only predictions and may change as time passes. We do not assume any obligation to update that information. Actual events or results may differ materially from those projected, including as a result of changing industry and market trends, reduced demand for our products, the timely development of our new products and their adoption by the market, increased competition in the industry, intellectual property litigation, price reductions as well as due to risks identified in the documents filed by the Company with the SEC.

CAMTEK LTD.
Moshe Eisenberg, CFO
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SOURCE Camtek Ltd