Arteris FlexNoC IP and FlexNoC Resilience Package Licensed by Toshiba Corporation (Toshiba) for Advanced Driver Assistance Systems (ADAS)

Network-on-chip interconnect IP data protection enables simpler ISO 26262 functional safety qualification while increasing SoC complexity and performance

CAMPBELL, Calif. — Sep. 20, 2016  — Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that Toshiba has licensed  Arteris FlexNoC interconnect IP and the companion  FlexNoC Resilience Package for use in its image recognition processors for ADAS applications.

The Toshiba team chose Arteris FlexNoC as their on-chip interconnect IP after an exhaustive evaluation of nearly all the commercial crossbar- and NoC-based interconnects available on the market today. The evaluation quantified all aspects of the IP, not only performance metrics like bandwidth and latency but also ease of implementation, design flow integration, and support quality.

Toshiba’s image recognition processors are highly integrated systems, with many processing engines and image processing accelerators working in parallel. Arteris FlexNoC excelled due to its ability to optimally manage the  high bandwidth and low latency quality of service (QoS) requirements for these near real-time systems. Implementing the features provided by the FlexNoC Resilience Package, such as error-correcting code (ECC) protection of on-chip communications and hardware duplication of interconnect components, helps the Toshiba design team more easily meet the diagnostic coverage requirements for the highest  ISO 26262 automotive safety integrity levels (ASIL).

“As our ADAS image recognition processors have increased in complexity, we encountered limitations in older on-chip interconnect technologies,” said Nobuaki Otsuka, Senior Manager of Mixed Signal IC Design Department at Toshiba. “The Arteris network-on-chip technology scales much better, allowing us to increase the performance of our SoCs while reducing wire routing congestion and timing closure issues. The data protection technologies in the FlexNoC Resilience Package allow us to more easily implement state-of-the-art functional safety features in hardware, which simplifies the tasks of our software development teams as we strive to meet the most stringent ISO 26262 requirements.”

“We are honored that Toshiba has chosen Arteris technology as the interconnect backbone for their premier vision ADAS SoCs,” said K. Charles Janac, President and CEO of Arteris. “Toshiba’s choice is proof of Arteris interconnect IP’s ability to help designers of complex systems meet the strictest ISO 26262 functional safety requirements more simply and with less complexity than using software-only solutions.” 

About Arteris

Arteris, Inc. provides  system-on-chip (SoC) interconnect IP and tools to accelerate SoC semiconductor assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as  SamsungHuawei / HisiliconMobileyeAltera, and  Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.



Contact:

Kurt Shuler
Arteris Inc.
+1 408 470 7300
Email Contact

Featured Video
Editorial
Jobs
Mechanical Engineer 2 for Lam Research at Fremont, California
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise