Rambus Expands Cryogenic Memory Collaboration With Microsoft

Companies begin to develop prototype systems that optimize memory performance

SUNNYVALE, Calif. — (BUSINESS WIRE) — April 17, 2017Rambus Inc. (NASDAQ: RMBS) today announced an expanded collaboration with Microsoft researchers to develop prototype systems that optimize memory performance in cryogenic temperatures. Following the initial collaboration announced in December 2015, this new agreement extends joint efforts to enhance memory capabilities, reduce energy consumption and improve overall system performance.

The technologies being developed by the companies will improve energy efficiency for DRAM and logic operation at cryogenic temperatures, defined by the U.S. National Institute of Standards and Technology as below −180 °C or −292.00 °F or 93.15 K and ideal for high-performance super computers and quantum computers. Additionally, it will enable high-speed SerDes links to operate efficiently in cryogenic and superconducting domains and allow new memory systems to function at these temperatures.

“With the increasing challenges in conventional approaches to improving memory capacity and power efficiency, our early research indicates that a significant change in the operating temperature of DRAM using cryogenic techniques may become essential in future memory systems,” said Dr. Gary Bronner, vice president of Rambus Labs. “Our strategic partnership with Microsoft has enabled us to identify new architectural models as we strive to develop systems utilizing cryogenic memory. The expansion of this collaboration will lead to new applications in high-performance super computers (HPC) and quantum computers.”

“We’re excited to continue working with Rambus and broaden our partnership to further develop technologies for memory optimization in cryogenic temperatures,” said Doug Carmean, partner architect within Microsoft’s research organization. “Rambus’ expertise in memory systems has helped us identify new memory architectures to meet our future requirements.”

Rambus has a long history of researching and exploring emerging platforms, consistently developing meaningful technologies with broad applicability.

For more information, visit: https://www.rambus.com/emerging-solutions/cryogenic-memory.

Follow Rambus:

Company website: rambus.com

Rambus blog: rambus.com/blog

Twitter: @rambusinc

LinkedIn: www.linkedin.com/company/rambus

Facebook: www.facebook.com/RambusInc

About Emerging Solutions Division

Inspired by the innovative thinking at the heart of Rambus Labs, the Emerging Solutions division at Rambus works to translate extraordinary theory into everyday practice, imagining exciting new ways to interpret and reimagine the world of data around us.

About Rambus Inc.

Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.



Contact:

Rambus Inc.
Agnes Toan, 408-462-8905
Corporate Communications
Email Contact

Featured Video
Editorial
Jobs
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Equipment Engineer, Raxium for Google at Fremont, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise