Presentation Highlights Convergence of Additive Manufacturing and Industrial IoT Applications

ALBUQUERQUE, N.M. — (BUSINESS WIRE) — August 30, 2017 — Optomec, a leading global supplier of production grade additive manufacturing systems for 3D printed metals and 3D printed electronics, today announced that its President and CEO, Dave Ramahi, will give a presentation titled “Additive Manufacturing for Direct Integration of 3D Sensors for IoT Applications” in the Structural and Physical Health Monitoring track at the InterPACK Conference in San Francisco, Calif., this week. Optomec additive manufacturing solutions are used in production today to print conformal strain gauges directly onto turbine engine components that collect mechanical deformation data for cloud-based analysis, establishing the convergence of 3D printing and IoT applications. InterPACK 2017 is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS and NEMS.

Mr. Ramahi’s presentation will take place at 10:15 a.m. on Aug. 30, in the Structural and Physical Health Monitoring track. Mr. Ramahi will discuss how Optomec’s Aerosol Jet system can directly print sensors and antennas onto existing 3D structures, or be used to more tightly package traditional discrete sensors and antenna in a 3D setting. This enables production of Smart Products that are an essential building block for the Internet of Things (IoT) and Industrial Internet applications. Optomec’s Direct Write 3D printing technology improves upon legacy discrete sensor & antenna production methods, which are generally 2D, and fail to optimize for cost, size, weight and performance when adapted to 3D products. Mr. Ramahi will also share how Optomec is developing sets of parametric sensor and antenna reference libraries that are optimized for 3D printing to help speed the adoption of Smart Product solutions. For more information on Aerosol Jet 3D printing, click here.

About InterPACK

InterPACK is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The conference has a comprehensive scope that includes thermals/mechanics, materials, manufacturing, MEMs/NEMs, photonics thrusts with special emphasis on advanced packaging architectures, and electrical and heterogeneous integration. InterPACK will deliver tangible value to attendees, such as cutting-edge research results by 50 invitation only-presentations from industry, national labs, academia scientists, engineers and scholars. For more information on the conference, click here.

About Optomec

Optomec is a privately-held, rapidly growing supplier of Additive Manufacturing systems. Optomec’s patented Aerosol Jet Systems for printed electronics and LENS 3D Printers for metal components are used by industry to reduce product cost and improve performance. Together, these unique printing solutions work with the broadest spectrum of functional materials, ranging from electronic inks to structural metals and even biological matter. Optomec has more than 300 marquee customers around the world, targeting production applications in the Electronics, Energy, Life Sciences and Aerospace industries.

LENS (Laser Engineered Net Shaping) is a registered trademark of Sandia National Laboratories. Aerosol Jet and Optomec are registered trademarks of Optomec Inc.

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