Smart amplifier software technology that creates much louder and richer sound for smartphones, wearables and headsets fully-optimized for world's lowest power audio/voice DSP

BARCELONA, Spain, Feb. 27, 2018 /PRNewswire/ -- Mobile World Congress 2018 -CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced the availability of Dynamic Speaker Management (DSM™) software from Maxim Integrated Products, Inc. (NASDAQ: MXIM) for the CEVA-TeakLite-4 family of ultra-low power audio/voice DSPs. The DSM optimized software implementation running on CEVA-TeakLite-4 is already integrated into a smartphone SoC from a Tier-1 smartphone OEM.

Many devices, including smartphones, headsets and wearables encounter significant challenges when it comes to speaker design. The requirement for increasingly smaller micro speakers and the power constrains in these devices severely limits the sound quality possible using conventional D-class amplifiers. DSM™ running on the CEVA-TeakLite-4, together with Maxim's boosted IV sense Class D speaker amplifiers overcomes these challenges, delivering a much richer sound experience with 2.5x louder sound and 2 octaves deeper bass versus conventional Class D amplifiers.

"At Maxim, we are constantly pushing the boundaries of the sound quality possible from micro speakers, creating louder and richer listening experiences for our customers," said Jonathan Chien, managing director and general manager of Audio Solutions at Maxim. "DSM on the CEVA-TeakLite-4 DSP is already proven with a tier-1 smartphone OEM, and offers an exceptional solution for any speaker-constrained and power-sensitive mobile device."

"Consumers increasingly expect powerful sound from their mobile devices, despite the incredible small form factor & power budget constraints of smartphones, wearables and alike," said Moshe Sheier, director of strategic marketing at CEVA. "The combination of Maxim's DSM technology and our ultra-low-power CEVA-TeakLite-4 audio/voice DSP provides rich, powerful sound from even the smallest of micro speakers, without compromising reliability and power efficiency of the device."

About CEVA, Inc.

CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (802.11 a/b/g/n/ac/ax up to 4x4). Visit us at  www.ceva-dsp.com