- New products realize direct replacement from current SDIP6(F type) package products
TOKYO — (BUSINESS WIRE) — March 21, 2018 — Toshiba Electronic Devices & Storage Corporation (“Toshiba”) is expanding its line-up of SO6L IC-output photocouplers with a new wide leadform package[1] type SO6L(LF4). Shipments start today.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20180321006319/en/
Toshiba: IC-output photocouplers with a new wide leadform package type SO6L(LF4). (Photo: Business Wire)
The SO6L(LF4) package has a creepage distance of 8mm, which meets the industry’s standard creepage distance for SO6L.
To date, Toshiba has offered eight photocouplers in the SO6L(LF4) package: three for high-speed communication applications and five for IGBT/MOSFET drive applications. Now the company has added six photocouplers in the SO6L(LF4) package to its product portfolio: three for high-speed communication applications and three for IGBT/MOSFET drive applications.
The SO6L(LF4) package is footprint-compatible with the SDIP6(F type) package with wide lead-forming option and a maximum package height of 4.15mm. In addition, the SO6L(LF4) package has a maximum height of 2.3mm, which is approximately 45% thinner than the conventional SDIP6(F type) package. Its low profile package contributes to system size reduction and can be mounted in height-restricted locations, such as the back of a board.
Toshiba will release more IC-output photocouplers as direct replacements for the current SDIP6 (F type) package.
The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with 23% of sale-based market share in CY2016. (Source: Gartner “Market Share: Semiconductor Devices and Applications Worldwide 2016” 30 March, 2017)
Toshiba will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.
Applications
-
High-speed communication photocoupler
(Factory networking, digital interfaces, I/O interface boards, programmable logic controllers (PLCs), intelligent power module drive [2] etc.)
-
IGBT / MOSFET driver photocoupler
(General-purpose inverters, air-conditioner inverters, photovoltaic power inverters, etc.)
Features
- Package height: 2.3mm (max) [1.85mm lower than SDIP6(F type) (45% reduction)]
- Pin distance [3]: 9.35mm (min) [pin-compatible with SDIP6(F type)
Main Specifications
(The characteristic values are guaranteed under temperature ranges shown
below;
@Ta=-40 to 125℃ for TLP2710(LF4), TLP2766A(LF4)
@Ta=-40
to 110℃ for TLP2745(LF4), TLP2748(LF4), TLP5771(LF4), TLP5772(LF4),
TLP5774(LF4)
@Ta=-40 to 100℃ for TLP2719(LF4) )
|
New part
number
|
Current part number
|
Applications | Characteristic（new products） | |||||||||||
|
Supply current
|
Threshold input
|
Propagation delay time
|
Peak output
|
Common-mode
|
||||||||||
| TLP2710(LF4) |
- |
High-Speed
|
0.3 [5] | 1.0 | 250 |
- |
+/-25 |
|||||||
| TLP2745(LF4) | TLP715F | 3 | 1.6 | 120 |
- |
+/-30 |
||||||||
| TLP2748(LF4) | TLP718F | 3 | 1.6 [6] | 120 | - |
+/-25 |
||||||||
| TLP2719(LF4) [4] | TLP719F | TBD |
- |
800@Ta=25℃ |
- |
+/-10 |
||||||||
| TLP2766A(LF4) [4] | TLP2766F | 3 | 3.5 [6] | 40 |
- |
+/-20 |
||||||||
| TLP5771(LF4) | TLP701AF |
IGBT / MOSFET
|
3 | 2 | 150 |
+/-1 |
+/-35 |
|||||||
| TLP5772(LF4) | TLP700AF | 3 | 2 | 150 |
+/-2.5 |
+/-35 |
||||||||
| TLP5774(LF4) |
- |
3 | 2 | 150 |
+/-4 |
+/-35 |
||||||||
| Item | Package name | |||
| SO6L(LF4) | SDIP6(F type) | |||
| Height max (mm) | 2.3 | 4.15 | ||
| Creepage distances min (mm) | 8 | 8 | ||
| Clearance distances min (mm) | 8 | 8 | ||
|
Isolation voltage
BV S @Ta=25℃ (kVrms) |
5 | 5 | ||
