Moortec To Exhibit At The TSMC Europe Open Innovation Platform® Ecosystem Forum & Technology Symposium

July 15, 2018 - Moortec have also recently announced the availability of their new Internet of Things (IoT) focused embedded monitoring subsystem, targeting TSMC’s 40ULP (Ultra Low Power) process technology.

To support the rapidly evolving IoT landscape, today’s System-on-Chip (SoC) designs require solutions adapted to specific market constraints, which includes power efficiency and device reliability. Moortec’s new monitoring subsystem is developed specifically to physically monitor dynamic and static conditions deep within IoT enabled edge devices.

To find out more about this new smaller scale, lower power IoT focused subsystem as well as Moortec’s range of “off the shelf” monitoring IP on TSMC 28nm, 16nm, 12nm & 7nm, come and meet our team of experts at booth and discuss in person how your advanced node SoC programme can benefit from Moortec’s high performance in-chip sensors. Target applications areas include Datacentre & Enterprise, Automotive, AI, Mobile, Consumer and Telecommunications, which all utilise advanced node CMOS technologies.

Moortec provides market-leading embedded monitoring IP subsystems for today’s technologies and specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors. Moortec’s IP enables SoC designs to be performance optimised and monitored on a per die basis and offers support for AVS/DVFS.

If you are working on advanced node technologies it is highly likely that your SoC will require monitoring to enhance real-time performance optimisation and lifetime reliability. Understanding how the chip has been made (process) as well as understanding its dynamic conditions (voltage supply and junction temperature) has become a critical requirement for advanced node semiconductor design.

About Moortec

Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies from 40nm down to 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the consumer, mobile, automotive, high performance computing and telecommunications sectors. For more information, please visit  www.moortec.com.



Contact: 

Ramsay Allen
+44 1752 875133
Email Contact

Featured Video
Editorial
Jobs
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Equipment Engineer, Raxium for Google at Fremont, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Upcoming Events
FABTECH Orlando 2024 at Orange County Convention Center Orlando FL - Oct 15 - 17, 2024
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise