Toshiba Expands Ethernet Bridge IC Lineup for Automotive and Industrial Applications

--Three new products offer advanced interface protocol, low latency transfer and system optimizations--

TOKYO — (BUSINESS WIRE) — January 21, 2019Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup of automotive Ethernet bridge ICs with the new “TC9562 series”: TC9562AXBG, which offers more interfaces than Toshiba’s current bridge ICs, the TC9560 series; TC9562BXBG which supports Ethernet TSN[1] and Ethernet AVB[2]; and TC9562XBG, which offers simpler IC configuration than current products.
Sample shipments will start in February, and volume production will start in October.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190121005177/en/

Toshiba: New Ethernet bridge ICs "TC9562 Series" for automotive and industrial applications. (Photo: ...

Toshiba: New Ethernet bridge ICs "TC9562 Series" for automotive and industrial applications. (Photo: Business Wire)

The Ethernet AVB specification offers real-time reliable data transmission and is increasingly used in vehicles. Toshiba currently offers the TC9560 series of Gigabit Ethernet (10/100/1000Mbps) solutions compliant with IEEE 802.1AS[3] and IEEE 802.1Qav[4].

More and more road vehicles now have on-board connectivity, equipping them with internet and cellular access, and allowing information to be shared among on-board systems and devices and with external systems and services. On top of this, low latency communications are essential for advanced driver assistance systems (ADAS) and autonomous driving technologies. These developments all require more complex automotive communication systems supported by reliable transmission standards with real-time data delivery. The Ethernet TSN standard was developed expressly to meet these needs.

Toshiba’s new product family responds to market demand with support for both the current AVB and the new TSN networking standards. The TC9562XBG offers simpler implementation than the current product family. TC9562AXBG supports expanded interface capabilities with SGMII, plus the RGMII, RMII and MII[5] interfaces, of current products. TC9562BXBG supports Ethernet TSN standards IEEE 802.1Qbv, IEEE 802.1Qbu[6] and IEEE 802.3br[7] in addition to TC9562AXBG’s capabilities.

Toshiba is targeting a low-power mode for the TC9562 series of 0.5mW power consumption and a 100ms recovery time (typical)[8].

The new bridge ICs will be AEC[9]-Q100 grade 3 qualified.

Applications

In-vehicle infotainment, telematics, audio amplifier and industrial equipment

 

Outline of New Products

 
Part Number   TC9562XBG/TC9562AXBG/TC9562BXBG
CPU core Arm® Cortex®-M3
HOST Interface PCIe I/F: Gen2.0(5GT/s), Endpoint , Single lane
Automotive Interface - Ethernet AVB MAC integrated

Choice of SGMII/RGMII/RMII/MII Interface
(TC9562AXBG, TC9562BXBG support SGMII )
compliant with IEEE802.1AS, IEEE802.1Qav standards

- Ethernet AVB/TSN MAC integrated (Only for TC9562BXBG)
compliant with IEEE 802.1Qbv, IEEE 802.1Qbu, IEEE 802.3br standards

Audio Interface Choice of I2S or TDM
Peripheral Interfaces

- I2C or SPI

- Quad-SPI

- UART 2ch

- Interrupt ports

- GPIO

Supply Voltage Choice of 1.8V/3.3V (For I/O)

Choice of 1.8V/2.5V/3.3V (For RGMII/RMII/MII)

1.8V (For SGMII, PCIe)

1.1V (For Core)

Package   P-LFBGA 120 balls; 9mm x 9mm, 0.65mm pitch
 
 
Notes:
[1]   Ethernet TSN: IEEE802.1 Time Sensitive Networking
[2] Ethernet AVB: IEEE802.1 Audio/Video Bridging
[3] IEEE 802.1AS: Standard for time synchronization
[4] IEEE 802.1Qav: Standard for traffic shaping
[5] SGMII, RGMII, RMII, MII: Ethernet interface. SGMII = Serial Gigabit Media Independent Interface; RGMII = Reduced Gigabit Media Independent Interface; RMII = Reduced Media Independent Interface; MII = Media Independent Interface
[6] IEEE 802.1Qbv: Standard for Enhancements to scheduled traffic
[7] IEEE 802.1Qbu/IEEE 802.3br: Standard for Frame preemption/Interspersing Express Traffic
[8] Typical result at 20ºC in Toshiba measurement environment
[9] AEC: Automotive Electronics Council
 

1 | 2  Next Page »
Featured Video
Editorial
Jobs
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Equipment Engineer, Raxium for Google at Fremont, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Upcoming Events
FABTECH Orlando 2024 at Orange County Convention Center Orlando FL - Oct 15 - 17, 2024
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise