FLEX Conference to Co-locate with SEMICON West in 2022 MILPITAS, Calif. — November 3, 2021 — SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain, and FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, will co-locate at the Moscone Center in San Francisco, July 11-14, 2022. Registration for both events will open next spring. “With collaboration the fuel of microelectronics innovation, the co-location of SEMICON West 2022 and FLEX Conference 2022 promises to uncover new ways for semiconductor and FHE leaders to accelerate global digitization in ways that continue to improve how we work and live,” said David Anderson, president of SEMI Americas. FLEX Conference, in its 20th year, showcases innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex. At FLEX Conference 2022, keynotes, panels discussions, technical sessions, and product-based TechTALKS will highlight the latest advances in flexible and printed electronics, including applications that deepen interactions between users and their surroundings. The event will focus on equipment, processes, materials and applications driving the latest technology breakthroughs and how they help shape business strategy. The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West 2022. Registration will open in the spring of 2022. About SEMI SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), MEMS & Sensors Industry Group (MSIG) and the SOI Consortium, are SEMI Strategic Technology Communities, defined groups within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter. Association Contact Scott Stevens, Cardinal Communications for SEMI Americas Phone: 1.512.288.4050 Email: scottstevens512@gmail.com |