HSINCHU, Taiwan – December 27, 2021 – The latest advances in compound semiconductors, heterogeneous integration, smart manufacturing and green manufacturing will take center stage December 28-30 at SEMICON Taiwan 2021 as industry leaders and visionaries gather at the Nangang Exhibition Center, Hall I (TaiNEX 1) for the latest innovations and trends driving microelectronics industry growth. Registration is open for the region’s premier event for the electronics manufacturing supply chain in Taiwan.
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SEMICON Taiwan 2021 will feature more than 650 exhibitors at nearly 2,150 booths. Semiconductor industry giants including TSMC, Etron Technology, ASE, SPIL, WIN Semiconductors, Nanya Technology, PSMC , Unimicron, TEL, Applied Materials, ASM, Lintec, Hermes Epitek and DuPont and other leaders across the semiconductor supply chain will demonstrate innovations powered by cutting-edge technologies including artificial intelligence (AI), Internet of Things (IoT) and 5G.
“The global semiconductor market is projected to grow more than 20% with Taiwan's integrated circuit (IC) production expected to top NT$4 trillion in 2021,” said Terry Tsao, Global Chief Marketing Officer at SEMI and president of SEMI Taiwan. “To help fuel that growth, SEMICON Taiwan 2021 will feature business matching and other opportunities for the industry to drive innovations across advanced semiconductor manufacturing, advanced testing and strategic materials, and enhance its sustainability and environmental, social and governance (ESG) efforts while addressing other areas key to the ongoing industry expansion.”
Themed Exhibitions at SEMICON Taiwan 2021
Themed Forward as One, SEMICON Taiwan 2021 will feature the following four themed exhibitions while promoting Taiwan’s semiconductor industry development policies. New pavilions focusing on investment in Central Taiwan Science Park (Taichung) and Southern Taiwan Science Park (Tainan and Kaohsiung) will also highlight the event.
- Compound Semiconductor Innovation Zone – Leading companies such as WIN Semiconductors, IQE, Applied Materials and Hermes Epitek will highlight end-user applications of 5G, 3D sensing, lidar and radar, and powertrain. At SEMI Talks, experts from GaN Systems, UMC, Episil and National Taiwan University will explore Taiwan's competitive advantages in wide-bandgap (WBG) semiconductors. More than 10 leading companies will offer a deep dive into trends and breakthroughs enabled by compound semiconductor materials such as gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC).
- Heterogeneous Integration Innovation Zone – With the rise of 5G, AI and other leading-edge technologies increasing requirements for packaging and transistors extending beyond size limits, game-changing heterogeneous packaging technologies have emerged to fuel semiconductor advances to extend Moore’s law. ASE, SPIL and other leading players will showcase high-performance computing (HPC) technology, along with IC design, manufacturing, packaging and terminal system applications. Chiplets, 3D stacking, and substrate design will come into sharp focus.
- Smart Manufacturing Journey – Staged by ADLINK, AWS Taiwan, Beckhoff, FET, Siemens, and TM Robot, this hands-on interactive experience of the latest smart manufacturing solutions through virtual reality (VR) will showcase drone, AR smart glasses, and IoT applications. The exhibition will also promote the adoption of HPC in semiconductor manufacturing sites to improve yield and production capacity and facilitate digital transformation. In addition, its Cybersecurity Pavilion will address critical topics including hacker attacks; viruses; and cybersecurity drills, maturity evaluation and industry standards with the aim to enhance cybersecurity across the supply chain.
- Green Manufacturing Innovation Zone (New) – Demonstrating Taiwan’s commitment to sustainable development, this zone will gather technology giants such as TSMC, ASE, Nanya Technology, and PSMC to highlight innovative green manufacturing technologies and front-end applications. Success stories on green design, energy management, resource regeneration, and supply chain resilience will also be featured. In collaboration with the Taiwan semiconductor community, SEMI will launch its Semiconductor Industry ESG Sustainability Initiative, aimed at strengthening the industry’s sustainability strategies and demonstrating Taiwan’s commitment to sustainable manufacturing.
Workforce Development Pavilion
SEMICON Taiwan 2021 will connect young talent with career opportunities as industry leaders including TSMC, Applied Materials, ASE, ASML, DuPont, Entegris, Lam Research, Merck, Micron and TEL discuss talent development trends and career planning insights. The Workforce Development Pavilion will feature one-on-one talent matching and discussions on key topics including diversity and inclusion, women in technology and creating winning talent strategies.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Media Contacts
SEMI Taiwan
Ashley Huang
(03)560-1777 Ext.206
SEMI Taiwan
Connie Lin
(03)560-1777 Ext.211
Ogilvy PR
Ashley Lu
(02)7745-1557
