FLEX LOGIX COLLABORATING WITH MICROSOFT TO HELP BUILD SECURE STATE-OF-THE-ART CHIPS FOR US DEPARTMENT OF DEFENSE (DOD)

MOUNTAIN VIEW, Calif., July 11, 2022 — (PRNewswire) — Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has been selected to be part of a team of microelectronic industry leaders, led by Microsoft, to build a chip development platform with the utmost regard for security as demonstrated by the DoD RAMP Project. Flex Logix was chosen for its leading embedded (eFPGA) technology that enables chips to be reconfigurable after tape-out, allowing companies to adapt to new requirements, changing standards and protocols as needed.

"Security can mean a lot of different things. For eFPGA, it means providing a means for keeping circuitry secret by programming the eFPGA in a secure environment," said Geoff Tate, CEO and Co-founder of Flex Logix. "We're honored to be working with Microsoft to bring Flex Logix's eFPGA technology as part of their Advanced Commercial Capabilities project for the DoD RAMP program."

The RAMP project intends to address and replace the obsolete practices utilized by the United States Government in support of state-of-the-art custom IC and system-on-chip design especially those associated with physical or "back-end" design.  Given the long system lifetime of DoD systems, utilizing eFPGA provides the capability to make silicon changes to update algorithms or modify functionality and saves money by avoiding costly tape-outs and installation of replacement parts.

"Our collaboration with Flex Logix will help to advance  flexibility to chip design," said Mujtaba Hamid, General Manager, Silicon, Modeling and Simulation, Microsoft. "The company's eFPGA technology has demonstrated success in supporting mission-critical applications and we look forward to bringing this capability to support national security priorities."

Using Flex Logix's EFLX®, chip developers can implement eFPGA from a few thousand LUTs to hundreds of thousands of LUTs with performance and density per square millimeter similar to leading FPGA companies in the same process generation. EFLX eFPGA is modular so arrays can be spread throughout the chip, can have all-logic or be heavy-DSP, and can integrate RAM in an array of many types.

Leveraging Flex Logix's patented interconnect used in EFLX, Flex Logix has developed InferX™, an AI inferencing tensor accelerator that delivers the highest throughput per dollar compared to other edge inferencing solutions. The combination of EFLX, InferX and a host processor creates a cohesive programmable and reconfigurable cognitive system.

Product briefs for EFLX eFPGA are available now at https://www.flex-logix.com/resources/

About Flex Logix
Flex Logix is a reconfigurable computing company providing AI inference and eFPGA solutions based on software, systems and silicon. Its InferX X1 is the industry's most-efficient AI edge inference accelerator that will bring AI to the masses in high-volume applications by providing much higher inference throughput per dollar and per watt. Flex Logix's eFPGA platform enables chips to flexibly handle changing protocols, standards, algorithms, and customer needs and to implement reconfigurable accelerators that speed key workloads 30-100x compared to general purpose processors. Flex Logix is headquartered in Mountain View, California and has offices in Austin, Texas. For more information, visit  https://flex-logix.com.

MEDIA CONTACTS
Kelly Karr
Tanis Communications
Email Contact
+408-718-9350

Copyright 2022. All rights reserved. Flex Logix and EFLX are registered trademarks and InferX is a trademark of Flex Logix, Inc.

 

Cision View original content to download multimedia: https://www.prnewswire.com/news-releases/flex-logix-collaborating-with-microsoft-to-help-build-secure-state-of-the-art-chips-for-us-department-of-defense-dod-301583487.html

SOURCE Flex Logix Technologies, Inc.

Contact:
Company Name: Flex Logix Technologies, Inc.

Featured Video
Editorial
Jobs
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Engineer 2 for Lam Research at Fremont, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise