PICMG ratifies COM-HPC FuSa extensions Supporting high-performance mixed-criticality systems

WAKEFIELD, MA., NOVEMBER 16, 2022. PICMG, a leading consortium for the development of open embedded computing specifications, has announced major extensions to the COM-HPC Computer-on-Module (COM) standard with the ratification of COM-HPC 1.15 for Functional Safety (FuSa). COM HPC 1.15 supports workload consolidated high-performance mixed-criticality for real-time edge servers and clients that must execute not only safety controls but also vision, AI and IIoT gateway logic or even TSN based 5G communication.

COM-HPC 1.15 is a set of safety extensions that expand the FuSa capabilities of “safety island” blocks on modern chipsets out to the broader system. Available on all COM-HPC form factors – including the upcoming COM-HPC Client Mini – COM-HPC FuSa extensions define a dedicated SPI signal that connects health and status monitoring features of such blocks to a FuSa “safety controller” located on a COM-HPC carrier board where any findings can be processed for external use.

The COM-HPC 1.15 architecture thus enables the creation of multicore embedded mixed-criticality systems by providing a direct path to redundancy and fail-safe process implementation for developers of robotics and industrial machine controls, train and wayside controls, autonomous vehicles, avionics, and other critical systems.

“With the small size definition of the upcoming Mini specification and the FuSa extensions, COM-HPC covers all use cases I can think of,” says Christian Eder, Chairman of the COM-HPC technical committee and Director Product Marketing at congatec. “COM-HPC is the most complete computer module definition ever. I expect extremely fast growth for scalable and compute-power-hungry embedded applications based on COM-HPC technology.”

The COM-HPC 1.15 specification effort is sponsored by ADLINK, congatec, and Kontron.

For more information on the COM-HPC FuSa specification, visit www.picmg.org/openstandards/com-hpc, or purchase the specification for $750 from www.picmg.org/product/com-hpc-module-base-specification-revision-1-15.
More on PICMG’s range of open, modular computing standards can be found at
https://www.picmg.org.

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.
Key standards families developed by PICMG include COM Express, COM-HPC, ModBlox7, IoT.1, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information visit
https://www.picmg.org.

Reader enquiries:
PICMG
Jessica Isquith, President
Bernd Kleeberg, Chairman Technical Committee
www.picmg.org

Press contact:
SAMS Network
Michael Hennen
Telefon: +49-2405-4526720
Email Contact
www.sams-network.com

Please send print publications to:
SAMS Network
Sales And Management Services
Michael Hennen
Zechenstraße 29
52146 Würselen
Germany

Featured Video
Editorial
Jobs
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise