CEA-Leti Presents RRAM’s ‘Promising Advantages’ For Neuromorphic/In-Memory Computing at IEDM 2022

Separate Paper Reports Breakthrough End-to-End Gesture-Recognition System Targeting Wearables and Automotive Applications

SAN FRANCISCO – Dec. 7, 2022 – A CEA-Leti tutorial presented at IEDM 2022 highlighted promising advantages that resistive random-access memory (RRAM) technologies hold for implementing novel neuromorphic/in-memory computing systems for massively parallel, low-power and low-latency computation.

In a presentation titled “Resistive Memories-Based Concepts for Neuromorphic Computing”, Elisa Vianello, CEA-Leti’s edge AI program manager, said RRAMs, aka memristors, offer advantages in energy efficiency and computing power when processing AI workloads. She noted, however, scientists must overcome device issues, especially variability, quantization error and limited endurance to achieve commercialization of this approach.

During the conference, CEA-Leti also reported development of the first end-to-end, gesture-recognition solution for ultralow power implementation on silicon with an estimated always-on total power consumption of 0.41 μJ/frame. This breakthrough, presented in the paper “Spike-based Beamforming Using pMUT Arrays for Ultra-Low Power Gesture Recognition”, used low-power piezoelectric micromachined ultrasonic transducers (pMUTs) to emit and sense ultrasonic signals. This novel spike-based beamforming extracts spatial temporal information and a spiking recurrent neural network (SRNN) to perform simple gesture detection and classification.

Neuromorphic In-Memory Computing

In recent years, “neuromorphic” has been used to describe mixed-signal and pure digital systems that can be used to simulate spiking neural networks. As interest in the potential for this technology grew, the neuromorphic researchers were joined by material and device-physics researchers to study memristor properties and leverage their physics to implement neural and synaptic functions.

Meanwhile, artificial intelligence (AI) algorithms were being applied in healthcare, robotics, agriculture and other sectors, but those applications face power constraints. To address some of these challenges, CEA-Leti’s AI research focuses on the development of novel brain-inspired technologies and processing methods. This requires researchers in multiple disciplines to combine their efforts and simultaneously co-develop technologies, circuits, processing methods and the supporting computing architectures, Vianello said.

“Spike-based Beamforming Using pMUT Arrays for Ultra-Low Power Gesture Recognition”

Explaining CEA-Leti’s breakthrough end-to-end, ultralow power gesture-recognition solution, Emmanuel Hardy, lead author on the paper, said previously published systems in the literature were implemented with off-the-shelf sensors and readout electronics, so gesture recognition is always performed offline in software with full precision for the inference.

Traditional beamforming directly combines the sine waves in analog or digital format after applying delays. CEA-Leti’s spike-based technique simplifies the process by encoding the phase of a signal by a single spike per signal period. It then allows scientists to apply simple logic on spikes to implement beamforming. A spiking recurrent neural network (SRNN) takes the spike density as an input to perform gesture detection.

CEA-Leti’s end-to-end, gesture-recognition solution is suitable for ultralow power implementation on silicon with an estimated total power consumption of 0.41 μJ/frame. The breakthrough uses low-power sensors with pMUTs and extracts and processes the minimum information with CEA-Leti’s novel spike-based beamforming. It also includes classification in the spike domain with a SRNN. The institute also is working to develop an energy-efficient RRAM-based SRNN.

“Our system supports a fully integrated approach enabling ultralow-power, end-to-end operation,” Hardy said. “Its primary advantage is its low manufacturing cost and easy integration, which suits its use in wearable and automotive applications. The system could be also used for acoustic ranging with interesting applications in robotics and drones.”

About CEA-Leti

CEA-Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s  multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 3,100 patents, 11,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. CEA-Leti has launched 70 startups and is a member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti.

Technological expertise

CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.

For more information: www.cea.fr/english 

 

Press Contact                                                                                

Agency

Sarah-Lyle Dampoux

Email Contact

+33 6 74 93 23 47



Read the complete story ...
Featured Video
Editorial
Jobs
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Equipment Engineer, Raxium for Google at Fremont, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise