Hamamatsu Photonics adopts Siemens‘ mPower for optical semiconductor design

Siemens Digital Industries Software announces today that Hamamatsu Photonics K.K. (Hamamatsu Photonics), a leading provider of optical semiconductor devices, has adopted Siemens' award-winning mPower™ digital software for the power integrity analysis of its next generation of optical semiconductor devices.

By pursuing further advancement of photoelectric conversion technology to discover the true nature of light, Hamamatsu Photonics delivers high-sensitivity, fast-response and high-performance optical semiconductor devices. The company provides a wide range of products such as photodiodes, photo ICs, image sensors, infrared detection devices and LED offerings – all of which support multiple wavelength ranges (e.g., infrared, visible, ultraviolet, x-ray, high-energy). The products are widely used in many applications, including the scientific measurement, medical and automotive markets.



“Power integrity analysis is a critical technology for us, because our optical IC products need to achieve extremely high performance and reliability in order to meet stringent functionality requirements,” said Masaaki Matsubara, manager for the second design group, Design Center, Solid State Division for Hamamatsu Photonics. “We believe Siemens’ mPower digital software is our best option for improving IC performance and reliability. Our designers use the mPower solution to analyze their designs at early stages of development, and the software definitely helps to optimize the power source design faster.”

Introduced last year, Siemens’ mPower solution aids customers to more quickly and accurately perform sign-off analysis of the power, electromigration and IR-drop performance of integrated circuits (ICs), helping them to confirm that their as-implemented design will meet performance and reliability targets when manufactured.

Siemens’ mPower digital software provides power integrity analysis with high accuracy through fast and efficient distributed processing. Featuring an intuitive graphical user interface for optimal ease-of-use, the solution supports analysis across the IC design process, from initial concept design to design sign-off, helping users to create better designs with no compromise in quality or speed. For optimal reliability and IC traceability, the mPower solution also integrates seamlessly with Siemens’ Calibre® RVE software, which is part of its industry-leading Calibre® platform for IC physical verification.

“As image sensors grow in size and complexity, it becomes both harder and more critical to verify the power integrity of these very large designs,” said Joe Davis, senior director for Interfaces and EM/IR Product Management for Siemens EDA. “Hammamatsu Photonics quickly determined that the mPower solution provides the capacity, performance, and integration that they need in order to bring high performance, high resolution sensors to the market and we look forward to working with them as they bring more advanced designs to the market.”

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries, Siemens Digital Industries Software is where today meets tomorrow.

Featured Video
Editorial
Jobs
Mechanical Engineer 2 for Lam Research at Fremont, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Equipment Engineer, Raxium for Google at Fremont, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise