congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini:

congatec logo

Maximum performance for mini footprints

San Diego, CA, 10. October 2023 * * * congatec – a leading vendor of embedded and edge computing technology – welcomes PICMG’s ratification of the COM-HPC 1.2 specification, which introduces the COM-HPC Mini form factor. This new specification provides high-performance capabilities in a small form factor, measuring only 95 mm x 70 mm. Even devices with limited space can now benefit from the superior bandwidth and interface offerings of COM-HPC, including PCIe Gen 5 and Thunderbolt.

 

COM-HPC establishes itself as the most scalable Computer-on-Module (CoM) standard, covering a wide range of applications from small form factor designs to edge server designs. This simplifies the design-in process and enables the creation of complete product families with reduced engineering efforts. COM-HPC modules support not only specific processors like x86 or Arm but also FPGAs, ASICS, and AI accelerators, making it a comprehensive standard for developing innovative applications based on the latest embedded and edge data processing technologies.

 

Christian Eder, Chairman of PICMG's COM-HPC Working Group and Director of Market Intelligence at congatec, expresses his enthusiasm for the COM-HPC standard: “COM-HPC offers the highest performance, bandwidth, interfaces, and scalability compared to other computer-on-module standards and with COM-HPC Mini, engineers can now leverage all this on a real small form factor for space constrained embedded and edge computing designs.”

 

congatec is committed to supporting the adoption and implementation of the COM-HPC Mini specification, enabling customers to bring their solutions to market quickly. As a leading provider of embedded computing solutions, congatec also continues to develop and deliver products that align with the latest industry standards.

 

For more information about congatec and its COM-HPC ecosystem, please visit: https://www.congatec.com/en/ecosystems/com-hpc-ecosystem

 

The specification of congatec’s fist COM-HPC Mini module can be found here: https://www.congatec.com/en/technologies/com-hpc-mini/

 

The official PICMG COM-HPC page can be found here:

https://www.picmg.org/openstandards/com-hpc/

 

* * *

About congatec   

congatec is a rapidly growing technology company focusing on embedded and edge computing products and services. The high-performance computer modules are used in a wide range of applications and devices in industrial automation, medical technology, robotics, telecommunications and many other verticals. Backed by controlling shareholder DBAG Fund VIII, a German midmarket fund focusing on growing industrial businesses, congatec has the financing and M&A experience to take advantage of these expanding market opportunities. congatec is the global market leader in the computer-on-modules segment with an excellent customer base from start-ups to international blue chip companies. More information is available on our website at www.congatec.com or via LinkedIn, X and YouTube.

 

 

Text and photograph available at: https://www.congatec.com/us/congatec/press-releases.html

 

 

 

 

Reader Enquiries:

congatec

Farhad Sharifi

Phone: 858-457-2600

Farhad.Sharifi@congatec.com

www.congatec.us

 

Press Contact:

congatec

Janene Rae

Phone: 858-457-2600

janene.rae@congatec.com

www.congatec.us

 

PR Agency:

Publitek GmbH

Julia Wolff

+49 (0)4181 968098-18

julia.wolff@publitek.com

Bremer Straße 6

21244 Buchholz

Featured Video
Editorial
Jobs
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise