Compact Model Coalition Announces 2025 International Compact Modeling Conference
Save the Date and Submit Your Research
SAN FRANCISCO, CALIFORNIA, USA - November 21, 2024 - The Compact Model Coalition is organizing the 2025 International Compact Modeling Conference, a two-day in-person event bringing together global experts in design, process technology, and model development to discuss advancements in semiconductor device modeling.
The conference will be held from June 26-27, 2025, at The Clift Royal Sonesta in San Francisco, California.
Researchers and practitioners are invited to contribute to the evolution of device models through oral and poster presentations in the following areas:
- Application of Device Models
- Device Model Development
- Model Enhancements and Implementations
- Modeling for Future/Emerging Technologies and Applications
Abstract submission deadline is January 15, 2025.
To learn more or submit your research, visit
https://2025.si2-icmc.org/.
About the International Compact Modeling Conference
The International Compact Modeling Conference is a new annual conference co-sponsored by the Silicon Integration Initiative Inc. (Si2), the Institute of Electrical and Electronics Engineers (IEEE), and the IEEE Electron Devices Society (EDS).
About Si2
The Silicon Integration Initiative Inc. is a not-for-profit, research, and development joint venture that (Si2) was founded in 1988 as the CAD Framework Initiative (CFI). Learn more at
https://si2.org/.
About IEEE
IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Learn more at
https://www.ieee.org/.
About IEEE EDS
EDS fosters the professional growth of its members by satisfying their needs for easy access to and exchange of technical information, publishing, education, and technical recognition and enhancing public visibility in the field of Electron Devices. Learn more at
https://eds.ieee.org/.
Laura Leblanc
Conference Catalysts
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