Also Adds Small Size 8GB, 16GB and 32GB Flash Modules for Netbooks to Enhanced Line-up
IRVINE, Calif., and TOKYO, Sept. 25 /PRNewswire/ -- Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC)*, its subsidiary in the Americas, today announced enhancements to their line up of NAND-flash-based solid state drives (SSD) with the addition of an industry-leading 256-gigabyte (GB)(1) SSD and the launch of small-sized Flash Modules for netbook computers, ultra-mobile PCs (UMPCs) and other mobile and peripheral applications. The new drives will be showcased at CEATEC in Makuhari, Japan, from September 30 to October 4.
Samples of both the 256GB SSD and the Flash Modules are available now, with mass production following in the fourth quarter (October to December) of the year.
Toshiba's new high density SSD brings 256GB of capacity to a 2.5-inch drive form factor with an advanced Multi-level Cell (MLC) controller that achieves higher read-write speeds, parallel data transfers and wear leveling to optimize performance, reliability and endurance. Alongside this, Toshiba provides support for the growing market for small, netbook computers, UMPCs and other personal equipment with the launch of small SSD Flash Modules supporting 8GB, 16GB and 32GB densities.
The new 256GB SSD mounts NAND flash memory on a 70.6mm (L) x 53.6mm (W) x 3.0mm (H) platform. The drive offers performance characteristics essential for today's mainstream notebook PCs: highly reliable, high density data storage and support for fast data transfer rates, with a maximum read speed of 120MB per second (MBps)(2) and maximum write speed of 70MBps, via a SATA 3.0Gb per second (Gbps)(3) interface.
Flash Modules are fabricated on a 50mm x 30mm platform, and offer maximum read and write speeds of 80MB and 50MB per second(2), respectively. Flash Modules are also compatible with the SATA interface and will support continued development of the fast growing market for netbook PCs, UMPCs and mobile and peripheral applications by offering developers a wider range of SSD for integration in differentiated products.
Toshiba will continue to promote innovations that widen the horizons of the NAND Flash market and support its continued leadership in that market. The company will spur demand for SSD in notebook PCs, laptops and digital consumer products by enhancing its lineup, offering products with different densities and interfaces in a range of packages, while advancing device performance. For more information on Toshiba SSDs, please visit ssd.toshiba.com.
Outline of the new products
Type Product Number Capacity Samples Start of Mass
Production
256GB SSD THNS256GE8BC 256GB Sep., 2008 4Q, 2008
2.5-inch SATA
Flash Module THNSA08G0P4L 8GB Sep., 2008 4Q, 2008
SATA THNSA16G1P4L 16GB Sep., 2008 4Q, 2008
THNSA32G1P4L 32GB Sep., 2008 4Q, 2008
Product specification
256GB SSD
Interface Serial ATA-2 (3Gbps)
Voltage 5V (2.5-inch type)
Reading speed Maximum speed 120MBps (sequential mode)
Writing speed Maximum speed at 70MBps (sequential mode)
Temperature 0 to 70 degrees Celsius
Flash Module
Interface Serial ATA-2 (3Gbps)
Voltage 5V
Reading speed Maximum speed at 80MBps (sequential mode)
Writing speed Maximum speed at 50MBps (sequential mode)
Temperature 0 to 70 degrees Celsius
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue, April 2008). For additional company and product information, please visit http://www.toshiba.com/taec/.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
(1) When used herein in relation to memory density, gigabyte and/or GB means 1,024x1,024x1,024 = 1,073,741,824 bytes. Usable capacity may be less. For details, please refer to specifications.
(2) For purposes of measuring read and write speed in this context, 1 Megabyte or MB = 1,000,000 bytes. Read and write speed may vary depending on the controller, read and write conditions, such as file sizes you read and/or write.
(3) For purposes of measuring read and write speed in this context, 1 Gigabit or Gb = 1,000,000,000 bits. Read and write speed may vary depending on the controller, read and write conditions, such as file sizes you read and/or write.
Web site:
http://www.chips.toshiba.com/
http://www.toshiba.com/taec/
