STMicroelectronics Expands (U)SIM Card IC Offering with Two New 32-bit ARM-Based Families

GENEVA, Oct. 22 /PRNewswire/ -- ST32 and ST33 families boost support for latest SIM-based features and mobile services

GENEVA, Oct. 22 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), a world leader in smart card ICs, has introduced two new product families for cellular-phone SIM cards. The features enabled by the two new families will allow mobile network operators to enhance differentiation and expand revenue growth by delivering richer services to subscribers.

The ST32 and ST33 smart card processor families use the best-in-class ARM Cortex-M3 32-bit processor architecture, and its SC300 secure version, combined with large embedded-Flash memory capacities. All the new devices use ST's 90nm embedded Flash technology, delivering the combined benefits of increased capabilities, lower power, competitive price, and smaller chip dimensions.

The ST32 family uses the 32-bit ARM Cortex-M3 processor and contains two devices offering a choice of memory sizes. The ST32F416 and ST32F512 offer 416 Kbytes and 512 Kbytes of embedded Flash, respectively, and address the 128 K and 256 K 2G and 3G markets. Additional ST32 devices will be introduced with lower memory densities in the future.

The ST33 family targets the high-end SIM market, which requires the highest level of security. This family is based on the SC300 highly secure version of the ARM Cortex-M3 32-bit core. The ST33F1M, the first product in this range, features 1.2 Mbytes of embedded Flash with 30 Kbytes of RAM, an SWP (Single-Wire Protocol) interface for NFC (Near Field Communication) connectivity, and the most advanced cryptographic coprocessor (Nescrypt). With its intrinsic security level and wide availability of interfaces, the ST33F1M targets innovative (U)SIM markets such as Mobile Banking and Mobile TV. In addition, the large embedded-Flash memory size available will allow telecom operators to enrich the multimedia content of their (U)SIM cards.

All of the new devices meet industry standards for SIM card interfaces and communication, including ISO7816-3. In addition, ST33F1M also targets the highest security levels, such as CC-EAL5+ and EMVCo certifications. The devices also support standard power-management features laid down for cellular handsets, and achieve current consumption defined by GSM and ETSI standards.

"The new ST32 and ST33 product families complement ST's existing ST21 family, which is already successfully deployed in volume using both embedded Flash and EEPROM technology," said Laurent Degauque, Telecom and NFC Marketing Manager within ST's Smartcard Division. "The combination of these three comprehensive product families position ST as a major global supplier for (U)SIM applications, from the volume-driven market to highly secure and innovative high-end solutions."

The ST32F416 and ST32F512 are sampling now, with production availability scheduled for early 2009. The ST33F1M will begin sampling in February 2009, with volume ramp-up expected in mid 2009.

About STMicroelectronics

STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2007, the Company's net revenues were $10 billion. Further information on ST can be found at www.st.com.

Web site: http://www.st.com/

Featured Video
Editorial
Jobs
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Upcoming Events
Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025
3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025
TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025
Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise