Toshiba to Launch 43nm SLC NAND Flash Memory

Introducing the industry's largest density SLC NAND chip at 16Gb and enhanced SLC lineup

IRVINE, Calif, and TOKYO, Oct. 28 /PRNewswire/ -- Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC)*, its subsidiary in the Americas, today announced the launch of a new line-up of 43nm Single-Level Cell (SLC) NAND flash memory products available in densities ranging from 512Mbits(1) to 64Gbits(2) and in a total of 16 versions. The new range includes three products, 16Gb, 32Gb and 64Gb, which integrate 43nm monolithic 16Gb chips, the highest density SLC NAND chips available(3). The new devices will come to market from the first quarter of 2009.

SLC chips offer fast read and write times and support a large number of write and erase cycles. Toshiba developed the new SLC devices to meet diversifying applications, and its enhanced line-up offers support for mobile phones, office automation equipment, and servers, all of which require high levels of read and write speeds and reliability.

In recent years, Toshiba Corporation has promoted expansion of the NAND flash memory market by accelerating development of high density multi-level cell (MLC) chips to be used for high capacity data storage in such markets as memory cards and MP3 players. Production of SLC chips has been limited for Toshiba's 56nm and 70nm process technologies. In bringing a wider range of advanced SLC flash memories suitable for higher performance storage applications into its line-up, Toshiba aims to expand its selection of high-value added products for diverse embedded applications, and will promote mass production through the application of advanced process technology.



    Product Number    Capacity   Package   Page Size          Mass
                                                              Production

    TH58NVG6S2EBA20    64Gb       BGA     Large Block         2009, 1Q
    TH58NVG5S2EBA20    32Gb       BGA     Large Block         2009, 1Q
    TC58NVG4S2EBA00    16Gb       BGA     Large Block         2009, 1Q
    TC58NVG3S2ETA00    8Gb        TSOP I  Large Block         2009, 2Q
    TC58NVG2S3ETA00    4Gb        TSOP I  Large Block
    TC58NVG2S3EBAJX    4Gb        BGA     Large Block
    TC58NVG1S3ETA00    2Gb        TSOP I  Large Block         2009, 1Q
    TC58NVG1S3EBAJX    2Gb        BGA     Large Block         2009, 2Q
    TC58NVG0S3ETA00    1Gb        TSOP I  Large Block         2009, 2Q
    TC58NVG0S3EBAJ5    1Gb        BGA     Large Block         2009, 2Q
    TC58DVG02A5TA00    1Gb        TSOP I  Small  Block        2009, 3Q
    TC58DVG02A5BAJ5    1Gb        BGA     Small  Block        2009, 3Q
    TC58NVM9S3ETA00    512Mb      TSOP I  Large Block         2009, 2Q
    TC58NVM9S3EBAJW    512Mb      BGA     Large Block         2009, 2Q
    TC58DVM92A5TA00    512Mb      TSOP I  Small  Block        2009, 3Q
    TC58DVM92A5BAJW    512Mb      BGA     Small  Block        2009, 3Q

Features of the new products

    1. By applying leading edge 43nm process technology and advanced technology
       to increase data savings, the new products doubled in density compared to
       56nm SLC products. This enables the new memories to be applied to
       products that require higher performance and reliability.
    2. The writing speed is 2.5 times(4) faster than comparable Toshiba MLC NAND
       flash memory.



    16G bit product

    Product Number                          TC58NVG4S2EBA00
    Density                                 16G bit
    Power                                   3.3V
    Program time                            400ms/ page (Typ.)
    Delete time                             4ms/block (Typ.)
    Access time                             40 ms/(1st)
                                            25nano second(Serial)
    Size                                    14mm x 18mm

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue, April 2008). For additional company and product information, please visit http://www.toshiba.com/taec/.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com , or from your TAEC representative.

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