SAN JOSE, Calif., April 1 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today expanded its line of Dynastron(R) image sensor and chip scale camera modules (CSCMs) with the introduction of a new 8-megapixel (MP) CMOS image sensor and a 2MP CSCM in a 1/5-inch optical format. Both of these devices use Toshiba's 1.75-micron image sensor process technology which was designed to address the needs of the mobile handset market by delivering large pixel counts in a small form factor and capturing high-quality images in low-light conditions. These new imaging products are two of several products Toshiba announced today that expand the company's Mobile Strategic Initiative, a product and customer support program designed to facilitate ease of design for new mobile phones and other portable devices.

"As the overall sophistication of mobile handsets increases, so do the requirements of the camera solutions in these devices," said Andrew Burt, vice president of the Imaging and Communications Marketing Group in the ASSP Business Unit at TAEC. "We are excited to deliver these new products in our advanced 1.75-micron process technology, which allows us to support higher pixel counts in smaller form factors as well as help minimize power consumption in imaging solutions."

The 8MP Dynastron image sensor (part number ET8ER4-AS) is designed for use in high-end camera phones that offer auto-focus or optical zoom capabilities. It is available in a 1/2.5-inch optical format, making it a strong fit for mobile phone camera designs where small size is critical. The sensor is optimized for performing in low-light environments.

The 2MP CSCM uses Toshiba's through chip via technology to allow mounting and assembly of camera components in the chip wafer during manufacturing to reduce the module's size by as much as 64 percent in comparison to other camera modules. It features an integrated image signal processing function to give the CSCMs more digital still capture-type functionality.

Pricing and Availability

Engineering samples of the 8MP image sensor are available now, with mass production scheduled to begin in Q2 2009. It is sample priced at $20 each. The 1/5-inch format 2MP CSCM will be in mass production in Q2 2009 and is sample priced at $10 each.

About Toshiba's Mobile Strategic Initiative

Toshiba's Mobile Strategic Initiative, announced in 2007, combines an expanded product portfolio, support tools (color tuning, reference designs and evaluation boards,) and the company's cooperation with baseband, application processor, I/O and core vendors to help TAEC customers address tough issues facing the current and future mobile handset/portable consumer electronics designs, including system integration, emerging standards and interoperability. Additionally, TAEC provides local application and design-in support and access to a host of analog peripheral ICs from other Toshiba divisions and business units, including the Toshiba Dynastron CMOS image sensor/module family, LCD drivers, I/O expanders, memory products and LCD panels.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2008 WW Semiconductor Revenue Estimate, Dec. 2008). For additional company and product information, please visit http://www.toshiba.com/taec/.

Trademarks and trade names appearing herein are the property of their respective owners and may be registered in the United States and other jurisdictions.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative. Dynastron is a registered trademark of Toshiba Corp. in certain jurisdictions.

Web site: http://www.toshiba.com/taec/