Agreement leverages strengths of HKSTP’s new Secure Virtual IP Chamber

Hong Kong, —August 18, 2009 — Hong Kong Science and Technology Parks Corporation (HKSTP) today signed an agreement with IBM (NYSE: IBM) to make IBM’s PowerPC system-on-chip (SoC) intellectual property (IP) available through HKSTP’s new Secure Virtual IP Chamber.

The IP agreement will enable HKSTP’s partner companies and clients all over the world to use IBM’s advanced technology to design prototype products with PowerPC cores in a secure environment that can significantly reduce risk and improve time-to-market at competitive cost.

“We are very delighted to expand our relationship with IBM, which first started in 2007, to create value for our partner companies and clients,” says Mr. Allen Yeung, Vice President of Business Development and Technology Support of HKSTP, “The milestone agreement reflects the endorsement and confidence of IBM in the strengths of HKSTP’s Secure Virtual IP Chamber enabling IP protection and technology collaboration.”

SoC technology enables smaller, thinner and longer battery life for consumer electronics such as mobile phones and digital cameras. SoC refers to the placing of multiple-function systems on a single silicon chip and has been key to advancements in the semiconductor industry. But integrating SoC involves time consuming development of in-house IP as well as acquiring IP license from external developers. The process of integration thus requires substantial IP collaborations. Such collaboration in the past was not that forthcoming due to trust issues between IP suppliers and IC design companies.

With the launch of the Secure Virtual IP Chamber by HKSTP today, the previous issues become irrelevant with HKSTP servicing both companies as the neutral third party in a trusted environment certified by ISO27001:2005 Information Security Management System.

The Chamber provides HKSTP’s partner companies and global clients with secure online access to a wide array of powerful resources including software, IP, information and materials in circuit and systems design and product manufacturing. It also provides IP by leading international suppliers, including ARM, Cadence and Synopsys, in addition to IBM, at as little as a quarter of the original costs in some areas. Electronics companies and industries using IT solutions will be the first to benefit from the agreement.

Mr. E. Anthony Tan, Chief Executive of HKSTP, says: “The PowerPC core agreement and the establishment of the Secure Virtual IP Chamber show HKSTP’s commitment not only to IP protection for technology development, but also our dedication to driving Hong Kong forward as a regional hub for technology and innovation.”

“HKSTP will continue to form strong alliances with key technology vendors like IBM and provide services such as the Secure Virtual IP Chamber to help companies innovate and create value,” he added.

“IBM is expanding its Power Architecture, the most scalable architecture in the world, in collaboration with a number of companies that can add unique value to that Architecture," said Bernard Meyerson, IBM, Vice President of Strategic Alliances. “Working with HKSTP as a trusted IP partner, we are providing our customers with greater value by giving them the option to evaluate, design, and use IP in a well-protected environment while enabling them to achieve cost and time-to-market goals,”

Power Architecture® is one of the world’s key embedded CPU architectures and a dominant player in routers, networking equipment, 3G base stations, storage, automotive, multimedia gaming and Digital/Interactive TV. In a further expansion of IBM’s efforts to provide this technology to universities, the company is now providing HKSTP-designated users with commercial cores (IBM 405 and 460 cores) with SoC. The Secure Virtual IP Chamber service facilitates access to services that help keep the cost for designing prototypes low.

The new agreement builds on the partnership HKSTP and IBM put in place in 2007 to promote semiconductor foundry services in the Asia Pacific region by leveraging IBM’s leading semiconductor technology.

About Hong Kong Science and Technology Parks Corporation

Hong Kong Science and Technology Parks Corporation (HKSTP) is a statutory body set up by the Government of the Hong Kong Special Administrative Region.

HKSTP provides innovative and technology driven infrastructure and support facilities which includes market focused clustered laboratory services enabling Hong Kong industries and services to be more competitive; provides a full-service incubation programme for technology and design start-ups; and fosters partnerships and collaboration between industry and universities/applied research institutes through consulting, training and research programmes. HKSTP offers advanced facilities and support services for high technology companies that include an IC Design Centre, an IC Development Support Centre, a Materials Analysis Laboratory, a Wireless Communications Test Laboratory, an Intellectual Property Servicing Centre, a Solar Energy Technology Support Centre and a Biotech Centre.

More information about HKSTP is available at www.hkstp.org.



Contact:

Pauline Ko
Hong Kong Science and Technology Parks Corporation
Tel.:852-2629-6710
E-mail: Email Contact

Dorothy Fung/ Joyce Mok
Upstream Asia
Tel.:852-2973-0222
E-mail: Email Contact