Omron Advanced 3D SPI, AOI and AXI Technologies on display at the 2014 IPC APEX Expo

North American Semiconductor Equipment Industry Posts February 2014 Book-to-Bill Ratio of 1.00

IEC ELECTRONICS CORP. FIRST TO EARN CERTIFICATION AS QUALIFIED MANUFACTURER TO IPC J-STD-001/IPC-A-610

Avnet Electronics Marketing Introduces Xilinx Zynq-7000 All Programmable SoC 7Z100 Mini-Module Plus, the Ultimate System-on-Module

Grid Connect Inc. Selected as Exclusive North American Distributor of High-Flying Products

KALRAY to showcase low power, live Ultra HD (4K) HEVC encoder at CCBN 2014 in collaboration with DivX

Nick Florek, CEO General Lattice

Jon Toews, Senior VP A3D Manufacturing

Emmanuel Leroy, EVP ESI Group

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Shape Your World by Sanjay Gangal Manufacturing and Innovation at the Forefront: Autodesk’s Vision for the Future

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Mechanical Engineer 3 for Lam Research at Fremont, California

Equipment Engineer, Raxium for Google at Fremont, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025