Intel Raises Second-Quarter and Full-Year Revenue and Gross Margin Expectations

Pasternack Introduces All New Line of X Band Amplifiers

Microchip Announces Industry’s Lowest Power Projected-Capacitive Touch Controllers

Samsung Introduces Versatile New Flip Chip LED Packages and Modules

Toshiba Launches Ultra-Small Chip Scale Package White LEDs for Lighting Applications

Altera and Intel Extend Manufacturing Partnership to Include Development of Multi-Die Devices

Dan Fernback, VP JuggerBot 3D

Nick Florek, CEO General Lattice

Emmanuel Leroy, EVP ESI Group

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Shape Your World by Sanjay Gangal Manufacturing and Innovation at the Forefront: Autodesk’s Vision for the Future

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Equipment Engineer, Raxium for Google at Fremont, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Mechanical Engineer 2 for Lam Research at Fremont, California

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025