Broadcom Adds HEVC to Set-top Box Chip Portfolio for Emerging Markets

FlexTiles Adaptive Multicore SoC Virtual Platform Now Available From Imperas

Intersil's Latest Automotive Video Decoder with MIPI-CSI2 Output Interface Supports Next-Generation SoCs

Synopsys' IC Compiler II Used to Tape Out 28-nm-FD-SOI SoC

Marvell Launches Industry's Smallest, Most Power Efficient, MU-MIMO Wireless Connectivity Combo for Enterprise and Consumer Markets

Intel to Acquire Altera

Dan Fernback, VP JuggerBot 3D

Emmanuel Leroy, EVP ESI Group

Nick Florek, CEO General Lattice

MCADCafe Editorial by Sanjay Gangal Designing the Hyperloop Dream: A Student-Led Odyssey in Future Mobility

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Engineer 2 for Lam Research at Fremont, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Equipment Engineer, Raxium for Google at Fremont, California

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025