Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI

Qualcomm Launches New, AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform to Help Drive the Evolution of Smart Audio

New Single-Chip Qualcomm DDFA Amplifier Solution Helps to Bring Clear, Powerful Sound for a Wider Variety of Speakers

U.S. Department of Energy and Intel to Deliver First Exascale Supercomputer

ON Semiconductor Introduces New Industrial and Automotive Qualified SiC MOSFETs Complementing a Growing Ecosystem and Bringing Wide Band Gap Performance Benefits to Rapid Growth Applications

MxC 300 AC-DC Power ICs from Helix Semiconductors Now Sampling

Nick Florek, CEO General Lattice

Jon Toews, Senior VP A3D Manufacturing

Emmanuel Leroy, EVP ESI Group

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Shape Your World by Sanjay Gangal Manufacturing and Innovation at the Forefront: Autodesk’s Vision for the Future

Mechanical Engineer 2 for Lam Research at Fremont, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Equipment Engineer, Raxium for Google at Fremont, California

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025