Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications

Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade

Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities

TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions

Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling

PowerSHAPE2012 What is New? Delcam

Tripp Burd, Manager MarkForged, Inc

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MCADCafe Editorial by Sanjay Gangal Designing the Hyperloop Dream: A Student-Led Odyssey in Future Mobility

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Equipment Engineer, Raxium for Google at Fremont, California

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Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Additive Manufacturing Forum 2025 at Estrel Convention Cente Berlin Germany - Mar 17 - 18, 2025