Broadcom Breaks New Ground with Trident SmartToR, Converging Switching, Routing, and L4-L7 Services

Broadcom Unveils the Industry’s First Open AIOps Platform Delivering a New Level of Full-Stack Observability for Hybrid Clouds

Semiconlight, a company with original technology for silver free-flip chip LED, signed a flip chip patent right with a large Chinese LED chip manufacturer

ROHM Announces New VCSEL Module Technology, Increasing the Output of Spatial Recognition and Ranging Systems by 30%

Nordic Semiconductor expands into Wi-Fi by acquiring the entire Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group

Broadcom Debuts Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure

Nick Florek, CEO General Lattice

Emmanuel Leroy, EVP ESI Group

Dan Fernback, VP JuggerBot 3D

MCADCafe Editorial by Sanjay Gangal Designing the Hyperloop Dream: A Student-Led Odyssey in Future Mobility

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Equipment Engineer, Raxium for Google at Fremont, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Mechanical Engineer 2 for Lam Research at Fremont, California

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025