CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds

Space-Grade Plastic 1Gb MRAM, Qualified to NASA/Goddard Space EEE-INST-002, Level 2 PEM, Offers the Highest Density, Lowest Power Hi-Rel Non-Volatile Memory

Renesas Launches RX140 MCUs with 2x Performance and Over 30 Percent Better Power Efficiency for Home and Industrial Applications

Renesas Introduces Highly Accurate, Cost-Effective Pressure Sensing Solution for Automotive Applications

Faraday Announces the Success of Its ARM-based SoCs in Wide Ranging Applications

BrainChip Goes Virtually Everywhere at AI Everywhere Forum 2021

Nick Florek, CEO General Lattice

Jon Toews, Senior VP A3D Manufacturing

Emmanuel Leroy, EVP ESI Group

MCADCafe Editorial by Sanjay Gangal Eagle Point Software Discusses the Peak Experience Update for Pinnacle Series at Autodesk University

Shape Your World by Sanjay Gangal Manufacturing and Innovation at the Forefront: Autodesk’s Vision for the Future

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Equipment Engineer, Raxium for Google at Fremont, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025

Automate 2025 at Detroit, Michigan, USA MI - May 12 - 15, 2025