Intel CEO Pat Gelsinger to Highlight the Impact of Bringing AI to Everyone, Everywhere during CES 2024 Keynote

Intel and NewPhotonics Achieve Breakthrough with 224Gbps Electrical SerDes and Photonics Engine Integration

Chipsea Technologies (Shenzhen) Co., Ltd., a "new player" in the global PC industry chain, has once again been awarded an Intel Platform Component List (PCL) certification, for its new EC product E2010

Ayar Labs Showcases 4 Tbps Optically-enabled Intel FPGA at Supercomputing 2023

Jabil Invests in the Future of AI with Intel Silicon Photonics Transceiver Deal

Intel Launches Industry’s First AI PC Acceleration Program

Knapheide Streamlines Truck Body Design with SolidWorks Software Knapheide

Hi Point Precision Products with PartMaker Delcam

Cullen Hilkene, CEO 3Diligent

MCADCafe Editorial by Sanjay Gangal MCADCafe Industry Predictions for 2025 – Tech Soft 3D

MCADCafe Guest Blog by Sanjay Gangal Industry Predictions for 2025: The Resurgence of American Manufacturing Through Advanced Technology

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Equipment Engineer, Raxium for Google at Fremont, California

Collaborate North America 2025 at Novi MI - Jan 28, 2025

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025