Intel, TSMC Reach Agreement to Collaborate on Technology Platform, IP Infrastructure, SoC Solutions

LatticeECP2M FPGA Enables Low Cost PCI Express Bridge for VOIP Platforms Based on Intel(R) Architecture

NVIDIA Responds to Intel Court Filing

Intelop announces TCP-Offload Engine SoC IP with integrated GEMAC, ARP module and AMBA 2.0 bus interface running at 2-Gbps capable of managing thousands of simultaneous TCP sessions

Intellectual Ventures Acquires Transmeta Patent Portfolio

MagSil Corporation, a Developer of Magnetoresistive Random Access Memory (MRAM), Adds Dr. Stefan K. Lai, Intel®-Retired VP of Flash Memory Group, to Its Board of Directors

Knapheide Streamlines Truck Body Design with SolidWorks Software Knapheide

Hi Point Precision Products with PartMaker Delcam

Cullen Hilkene, CEO 3Diligent

MCADCafe Editorial by Sanjay Gangal Generative AI Takes Center Stage at Autodesk University: Revolutionizing Manufacturing Design and Engineering

MCADCafe Editorial by Sanjay Gangal Designing the Hyperloop Dream: A Student-Led Odyssey in Future Mobility

Mechanical Engineer 2 for Lam Research at Fremont, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Formnext 2024 - Additive Manufacturing (AM) and industrial 3D Printing at Messe Frankfurt, Messeparkhaus Rebstock, 60327 Frankfurt am Main Frankfurt Germany - Nov 19 - 22, 2024

Celebrate Manufacturing Excellence at Anaheim Convention Center Anaheim CA - Feb 4 - 6, 2025

3DEXPERIENCE World 2025 at George R. Brown Convention Center Houston TX - Feb 23 - 26, 2025

TIMTOS 2025 at Nangang Exhibition Center Hall 1 & 2 (TaiNEX 1 & 2) TWTC Hall Taipei Taiwan - Mar 3 - 8, 2025