Lattice Semiconductor Will Feature Real-Time 3D Video Converter at CES 2013
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Lattice Semiconductor Will Feature Real-Time 3D Video Converter at CES 2013

HILLSBORO, OR -- (Marketwire) -- Dec 17, 2012 -- Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced it will demonstrate 3D Impact Media's RealityBox, a low density LatticeECP3™ FPGA-based real-time 3D video converter, in its private "Mobile Innovation" meeting suite at the Consumer Electronics Show (CES) January 8-11 in Las Vegas. Lattice suite 2980 will be located in the East Tower, Las Vegas Hotel.

To register for a specific time to visit with Lattice and discuss how mobile innovation can help with your specific design challenges, please visit Lattice Mobile Innovation.

Using the RealityBox, any 2D as well as stereoscopic 3D video stream can be converted and shown on glasses-free 3D displays in real-time, enabling new applications such as broadcasting of live events in public venues or digital signage, where 3D content is seldom available and expensive.

The RealityBox hardware is designed to support full 1080p resolution up to 60 fps, or 720P up to 120fps, using an HDMI interface. The video pipeline supports 2D/S-3D to S-3D/AS-3D conversion, real time playback of 2D+Z videos and allows disparity analysis of S-3D input signals. The main building blocks are an input/output scaler, disparity/motion estimator, temporal stability filter, image peaking, contrast, brightness adjustment and a programmable multi-view generator. The hardware can be used for barrier and lenticular technology-based glasses-free 3D displays. All parameters are freely programmable to support different types of 3D displays, including fractional views. The maximum amount of views that can be generated is 1024.

The cost attractive, high quality 3DIM conversion pipeline has an onboard OSD (on-screen display) that can be customized and includes ticker and image overlay options that can be added to the video stream. Due to its flexible design and low latency, as well as the LatticeECP3 device's low power, the RealityBox can be used in many different 3D applications, including next generation gaming machines and in-flight entertainment. In medical applications, the RealityBox can help improve depth perception, allowing for more precise surgical procedures, and in automotive applications it can be used for object recognition and assistance to make driving safer.

"The combination of Lattice's innovative, low density FPGA technology and 3D Impact Media's conversion IP creates an ideal product for customers who want a cost effective, high quality conversion pipeline," said Laurent Mueller, Chief Executive Officer at 3D Impact Media.

"It is exciting that 3D Impact Media has selected the LatticeECP3 FPGA as the processing engine in their RealityBox, enabling the best 3D viewing experience without the need for special glasses," said Kambiz Khalilian, Lattice Marketing Manager for Industrial Markets. "This is another example of how Lattice's portfolio of low density and ultra-low density FPGAs is finding broad use in a wide variety of new applications and markets."

Pricing and Availability
The RealityBox is available to buy from 3D Impact Media. Please contact 3D Impact Media at Email Contact for detailed pricing and availability.

A New Breed of FPGAs for Mobile Innovation
The relentless demand to design consumer and mobile products with new and differentiating features produces very short product development cycles, and the pressure to meet these schedules leads to more reliance on standard chips -- i.e. fully loaded application processors. But this creates a dilemma: application processor chipsets take two to three years to develop, which means that any device available today was defined two or three years ago -- and that, given the breakneck pace of consumer demand, is an eternity.

So, what is the designer of consumer and mobile products to do? In order to meet unforgiving schedules, readily available chipsets must be used. But yesterday's application processors often fail to meet today's market demands.

One approach would be to use an FPGA as a "companion" to the application processor, enabling designers to respond to contemporary consumer demand without waiting years for new chipsets. But, until recently, this was not an option. FPGAs were simply too big, too expensive and too power-hungry for use in consumer devices.

Now, however, FPGAs like the LatticeECP3, MachXO2™ and ice40™ devices are specifically targeted at the needs of small, inexpensive, power-sensitive consumer devices. This new breed of FPGA can be used to supplement an application processor and enable designers to pursue continuous "mobile innovation."

Hands-on Examples of Mobile Innovation
In the Lattice suite at CES, visitors will have the opportunity to speak directly with Lattice senior executives and technical specialists about their own design requirements, and view demonstrations of design solutions that leverage Lattice's broad portfolio of low density and ultra-low density FPGA devices. In addition to the 3D Video Converter, demonstrations include:

To register for a specific time to visit with Lattice and discuss how mobile innovation can help with your specific design challenges, please visit Lattice Mobile Innovation.

About 3D Impact Media
3D Impact Media is a provider of embedded solutions and software for glasses-free 3D applications. 3D Impact Media offers a complete range of standard and customized products for the creation, conversion and playback of 3D content for a variety of 3D applications where performance, cost and quality are of high importance. For more information, please visit www.3dimpactmedia.com

About Lattice Semiconductor
Lattice is a service-driven developer of innovative low cost, low power programmable design solutions. For more information about how our FPGA, CPLD and programmable power management devices help our customers unlock their innovation, visit www.latticesemi.com. You can also follow us via Twitter, Facebook, or RSS.

Lattice Semiconductor Corporation, Lattice (& design), L (& design), LatticeECP3, MachXO2, ice40 and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

EDITORIAL/READER CONTACT:
Brian Kiernan
Corporate Communications Manager 
Lattice Semiconductor Corporation 
503-268-8739 voice
503-268-8688 fax

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